At the Intel Developer Conference in San Francisco Intel CEO Justin Rattner on Technology (Justin Rattner) presented a development called Hybrid Memory Cube (HMC) - a new round of evolution of memory DRAM. On its development Intel worked with Micron.
Benefits of Hybrid Memory Cube
Rattner explained the creation of HMC in the following way. With the growing load on servers , increasing the frequency and number of CPU cores , memory becomes a bottleneck, reducing overall system performance. DRAM memory in its current state meet consumer demands, but its capabilities will be soon exhausted, and then it's time to think about something more progressive. The solution in this case, according to Intel and Micron, is a memory Hybrid Memory Cube.
Demonstration system with Hybrid Memory Cube
Hybrid Memory Cube is the technology of three-dimensional layout of integrated circuits (3D stacking), supplemented with high-speed input-output interface. This is achieved due to high energy efficiency of memory (8 PJ / bit), and significantly, at times increasing the data rate - up to 128 GB / s! Shown at Intel Event HMC model was able to show the data rate of 1 Tbit / s while consuming 70% less energy than DDR3 memory . In this case, the multilayered architecture HMC can save up to 90% of the area occupied by the current memory modules.
Hybrid Memory Cube, performance
It is clear that HMC expect a bright future, Intel says that all developments in this direction will be focused on two important elements: energy efficiency and productivity. Related Products :
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