It was considered that the transition to larger wafers should be accompanied by using the most advanced lithography process technology. Decrease of chips while increasing the area of the silicon wafer for maximum economic benefit, unless you consider the cost of re-production. Ultimately, both methods of modernization must be recouped.
However, analysts from Future Horizons believe that there is economic benefit in the treatment of 450 mm wafers at a more mature production processes. Along the way, you can eliminate the use of sophisticated technologies such as immersion lithography. Increasing the diameter of plate will have some savings in cost and lack of risk factors in the form of new technologies will improve the level of yield product. Manufacturers can combine large silicon wafers with good run-lithographic techniques.