Almost a year ago, IDF Fall 2011 Intel showed benefits of memory chips layout. Technology was initiated by Intel and Micron, called Hybrid Memory Cube (HMC).
Last week, appeared the first version of HMC memory specification , which covers the characteristics of organization in the physical layer interface. In its current form datasheet HMC will be useful for creating high-performance hardware, networks, and test environments.
HMC creators believe that the development could become a common standard memory and applied not only in server hardware, but also in desktop computers, laptops, mobile devices and consumer electronics. The final version of specifications will appear by the end of this year.