Photolithography in the deep ultraviolet (EUV) is one of the main candidates for the title of the core technology of semiconductor devices in the future.
IBM was able to process 637 silicon wafers to install ASML NXE3300B light source power 44 W for 24 hours. Characteristically, bandwidth equipment was kept at 34 plates per hour, with the installation smoothly worked only 77% of the test time. As explained by Dan Corliss , leader development programs EUV, without interruptions could have processed more than 800 plates. In any case, the result was better than expected.
Relatively weak light source is one of the main problems in the deep ultraviolet photolithography, limiting the production speed . Thus, the previous EUV-installation, which was tested by IBM, coped with only seven plates. ASML announced some time ago, scanner, capable of handling 145 plates per day.
Within six months, IBM will provide ASML light source power of 80 watts.