We already know that Intel has prepared a semiconductor 10 nm without a transition to the new scanners with radiation in the hard ultraviolet range (EUV, 13 nm). The company will use the old 197-nm scanners and use projections for critical layers of four or three photomask. This lengthens the cycle of production , that we observe in Intel transition to release a 14-nm-. Nevertheless, according to the company, the growth of transistor density reduce the production cost of each transistor , which leads to a decrease in the cost of the crystal.
Similarly, the company will go in the transition to the production of 7-nm semiconductor. The autumn session of IDF 2014 a leading specialist of Intel company, Mark Bohr , said that the company is inclined to think that the 7-nm projection can do without the EUV-equipment. For the release of the 14-nm Intel solutions already uses three mask, so appreciates its ability to add to the processing of wafers fourth photomask.
Also at the annual autumn event Intel a few words were said about the contract manufacturing companies for the production of semiconductors. Let's start with the fact that the company is ready to offer its clients an experienced 10-nm process in late 2015. Thus, Intel confirms that transistor density it is ahead of its competitors for a period of eighteen months to two years.
In the company's plans to create a standard list of "branded" units for inclusion in the catalog of services to third-party developers can use ready-made things in the design of chips. In this catalog the company intends to include also elements and decision nodes from class processors Atom. Thus, Intel becomes a par with companies such as Synopsys and Cadence, and thus in some ways superior to them, keeping in stock for inclusion in another's SoC whole core.