Video cards based on the GPU AMD Fiji became the first consumer solutions with new memory type - HBM (high bandwidth memory). For the organization of high-speed data exchange between the memory chips and the GPU HBM chips it took place as close as possible - on a common silicon substrate.
In some ways a step backward. Memory and GPU performance in Fiji is a multi-chip package, which at the present stage of production reached more impressive results than those we demonstrated with AMD company partners. The company Samsung, for example, easily packs into three separate chip stack processor, DRAM, and NAND-flash. However, in the case of Fiji & HBM created a high-tech bridge with through-substrate (TSVs) compounds itself is conditional crystal.
AMD has announced that the release of the bridges has been the Taiwanese company UMC. At factories UMC are metallized with copper feedthrough channels as well as all the necessary signal and power wires for communications between the memory HBM, GPU and circuits on the circuit board card. The UMC company has completed its part of the work on the bridge at one of the milestones that illustrate the picture above. As you can see, the back end through connections is not exposed (located in the interior of the silicon substrate), and contact-balls for the installation of the GPU and memory not yet been created. For these only prepared pads.
Follow-up work, as well as the installation of HBM chipset and GPU to the bridge with the final packaging and testing carried out other Taiwanese companies - Amkor Technology and Advanced Semiconductor Engineering (ASE).
The enterprises ASE and Amkor are thinnest contact groups desoldering chips and large enough contacts for soldering bridge on the flip-chip substrate, and, in fact, the contact group on the substrate for flip-chip soldered everything sandwich on the video board. Compared with the conventional process it gets long, expensive and with a relatively high level of failure.
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