Initially it was reported that single-chip platform MediaTek Helio X25 will be released exclusively for Meizu company's smartphones. However, judging by the performance test GFXBench , LeEco company (formerly known as LeTV) prepares Le 2 smartphone platform MediaTek MT6797T, whose second name - Helio X25.
Recall that Helio X25 is an overclocked version of Helio X20. The new platform also has 10 cores, divided into three clusters, but it has two of the most productive core Cortex-A72 running at a frequency of 2.5 GHz instead of 2.3 GHz.
According to GFXbench, smartphone LeEco Le 2 is equipped with a 5.5-inch display with a resolution of 1920 x 1080 pixels, 3 GB of RAM and 32 GB of internal memory. The rear camera has a 16-megapixel image sensor, and front - 8-megapixel. It works on Android 6.0 Marshmellow operating system. Note that according to previous rumors, LeEco Le 2 is also equipped with a port USB Type-C and ultrasonic fingerprint scanner. Related Products :
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