The Chinese company LeEco (ex-LeTV) engaged in the development of the new flagship, which will be one of the first smartphones based on Qualcomm Snapdragon latest chip 821. It will be announced in September.
The new flagship LeEco appear on the market under the name LeEco Le 2S Pro, Le 3 Pro or Le Pro 3. It will be presented on September 21 at a special event LeEco in China. The novelty, according to recent data, in addition to quad-core Qualcomm Snapdragon 821 chip with Adreno 530 graphics will also get 6GB of RAM and 64 GB of internal memory, 16-megapixel rear camera and battery 5000 mAh. The smartphone will be clad in metal case 7 mm thick.
By the way, LeEco company expected to release the first smartphone based on Qualcomm Snapdragon 821, but Asus was ahead , the Taiwanese manufacturer, has presented in July ZenFone 3 Deluxe . The new smartphone from Asus Snapdragon processor 821 is already on sale in Taiwan. Related Products :
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