TSMC is ready to take orders for the 7-nm chips by April next year

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POSTER: computer news   ||   TSMC IS READY TO TAKE ORDERS FOR THE 7-NM CHIPS BY APRIL NEXT YEAR	DATE:2016-09-23
The home chef TSMC Research Unit - San Jack - spoke about the achievements and plans of the company. Because we are very worried about Apple's company, TSMC is excited to announce that it is doing everything possible that by the end of this year, was commissioned 10-nm process technology, and by April of next year it will be ready to take orders for the release of 7-nm chips.  The company also develops the production of chips with a bulk packaging crystals, called Integrated Fan Out Wafer-level Package (InFO-WLP) and refers to an incomplete 3D layout or arrangement of 2.5D.  Presumably, the new processor Apple A10 Fusion uses a package of  type InFO-WLP. Until now, TSMC company mainly offers manufacturing platform for the creation and production of solutions for mobile systems.  In the near future it will be added to the platform to develop solutions for supercomputers, automotive electronics, and items with an Internet connection.  Using a 7-nm manufacturing processors for servers will be able to operate at a frequency up to 3.8 GHz with a supply voltage of 1 V. Electronics IoT will be able to work with a power close to the threshold voltage values - about 0.4 V. Chips for vehicles without loss of performance will be able to withstand operating temperature up to 150 degrees Celsius. So it turns out that in recent years, TSMC every year inaugurates a new or improved process technology.  The company now operates 28+ HKMG and 16FF + technical processes.  Later this year, it will be introduced in the production process technologies 16FFC (energy efficient) and 10-nm.  Experienced release of 256-Mbit SRAM array using a 7-nm process technology has gone two months ahead of schedule.  Risk-production with the use of 7-nm process will be launched in the first quarter of 2017. Compared with the process technology 28+ HKMG process technology from 16 nm burrows provides 45% performance increase and reduced leakage  of up to 80%.  Plus there was a choice of four operating voltages.  Process technology with the norms of 10 nm process technology compared to 16FF + will provide a 50% reduction in chip area and a 50% increase in speed or a 40% decrease in consumption. Process technology with the norms of 7 nm compared to 10 nm process chips will provide increased performance by 15-20% or a decrease in consumption by 35-40%.  Accommodation gate transistor density while increase of 1.63 times.  Experienced 7-nm chip with cores ARM Cortex-A72 showed a 30% increase in performance and 56% lower consumption than in the version with the release in relation to the process 16FFC. TSMC also is working on the improvement of technical processes using built-in non-volatile memory.  Recently it became known that the company GlobalFoundries in 2018 plans  build in the processors memory eMRAM with the norms of 22 nm (on FD-SOI wafers).  TSMC company is also considering MRAM as the SRAM replacement for embedded solutions.  In addition, TSMC is working on embedded memory such as ReRAM (resistive).  Currently, TSMC's, like others, builds chips in 40nm of NAND-flash and developing 28-nanometer version of the technical process. Finally, TSMC did not rule out the possibility in the future to produce 5-nm transistors using FinFET (there are problems with the tunnel effect).   Related Products :

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