TSMC Company last month admitted that hopes to master 2-nm process technology, and over 3 nm process has its specialists. At the last quarterly reporting conference yesterday TSMC guide explained how it assesses the chances of the industry to cope with the transition to 3-nm process technology.
First of all, TSMC itself is just beginning to fund the development of 3-nm technology. Those skilled will have to decide what is required for the production of 3-nm products, which in this case will be used technologies and equipment. Mark Liu , president and one of the two directors general TSMC, said similar work of competitors. Anyway, he assured, three or four of the leading manufacturer of semiconductor products expect to learn 3-nm technology. This level of technical process still leaves a lot of questions.
TSMC will not rely solely on the "Moore's Law", using as far as possible advanced layout solutions such as "three-dimensional" chips. They will be used in the components segment for HPC. Several times it was said about the increased memory bandwidth. Apparently, TSMC is ready for the integration of high-speed memory types in the central and graphics processors.