In late August, Intel has finally updated the whole range of SSD, began to use multi-layer flash 3D NAND in almost all products. The exception is 500-th series SSD interface SATA 6 Gb / s in the form factor of 2.5 inches. In 3D NAND memory model 500-x series will move only after a year. As long as they use a planar NAND-flash. In 2017, Intel ramp up production 3D NAND, and will gradually expand the supply of branded SSD into four main markets: data center, workstation to client systems for embedded applications.
According to sources, DigiTimes website, expanding 3D NAND production volumes will enable Intel to challenge the leaders in flash memory market in the face of Samsung Electronics, SK Hynix, Toshiba and a number of Chinese manufacturers. Note, Intel company does not set itself the goal to conquer the market of SSDs in the past years. It produced quite expensive SSD and did not seek to compete with the volume of world leaders. Last year's modernization of the plant for the production of flash memory in the Chinese Dalian changes the situation. Thus, Intel has shown a willingness to become a serious player in the SSD market.
The source reveals that in February and March 2017 for the needs of the data center, Intel will begin mass production of SSD DC P4500 / P4600 / P4600 LP / P4500 LP PCIe interface and supports NVMe. Also in the second quarter will be released senior and junior SSD series for data processing centers with the interface SATA 6 Gb / s - a DC S4600 / S4500 and DC S3110. For workstations in the fourth quarter of 2017 will be released series SSD Pro 7600P (PCIe, NVMe) and Pro 5450s (SATA 6Gb / s). For client systems, as we have already heard , will be issued single-SSD 600p (BGA) and the SSD 545s (SATA 6Gb / s), what will happen in the fourth quarter of the year.
For the embedded market the company is preparing a version of the SATA-SSD 5430S (will be released in April) and SSD 5430S version in the form factor M.2 (will be released in July). In the third quarter will be a series of "embedded" SSD E 6500p, which will not use the 3D NAND, and will remain on the planar NAND-flash with the standards production 20 nm. The company expects that Flash memory production in the new year will bring more than this. Note, due to the modernization of production revenue from the issue of NAND-flash from Intel in the current year (for the first 9 months of 2016) was significantly less than in the same period last year.