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TSMC and IBM shared details about the 7-nm process technology


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 TSMC and IBM shared details about the 7-nm process technology


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POSTER: computer news   ||    TSMC AND IBM SHARED DETAILS ABOUT THE 7-NM PROCESS TECHNOLOGY

DATE:2016-12-07

Today, the final day of the annual conference of International Electron Devices Meeting (IEDM 2016).  At this event, developers and semiconductor manufacturers usually share something interesting and promising.  So, companies TSMC and IBM each separately reported on the achievements in the development of 7-nm process technology.  At the same time IBM announced the achievement of a record in reducing the FinFET transistor sizes, and TSMC company spoke about the creation of the world's smallest 6-transistor SRAM cell.  In addition, each company is confident in the commercial use of EUV-lithography at the production of 7-nm semiconductors.

Above the picture shows a diagram of a conventional transistor.  IBM record is a skilled 7-nm chip released using of EUV-lithography for critical layers, a step of the contact group 44/48 nm (contacted poly pitch or contacted gate pitch).  Previously, the smallest step CGP was the experienced 10-nm Intel chips, and it was equal to 56 nm.  Further, a skilled 7 nm chip IBM distance between the contacts of the first level of metallization is 36 nm (metallization pitch), and the distance between the fins (FIN) transistors - 27 nm.  Each transistor has an open contact 10 nm window (contact opening / physical gate length) and total gate length of 15 nm (gate length / printed gate length).

As mentioned above, to create a critical layers skilled 7-nm chip, IBM-use of EUV scanners.  Fin equal to 27 nm, was made possible thanks to the fourfold projection.  The gates were created using a double projection.  Instead of tungsten in cobalt IBM transistors used to increase the strength of semiconductor structures.

TSMC's company, as already mentioned above, told of the tightest in the industry 6-transistor 7 nm SRAM memory cell - just 0.027 mm2.  Compared with the process technology 16 FF + linear density increased in 3.3 times.  In this cell the speed with equal consumption increased by 40%, or a decrease in consumption at equal productivity decreased by 65%.  Note the memory cell is fully functional, with a decrease in supply to 0.5 V.


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 TSMC and IBM shared details about the 7-nm process technology


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Related news:

TSMC will increase the output of 12-nm NVIDIA products by the end of the year (2017-08-15)
Samsung is determined to narrow the gap with TSMC in the contract manufacturing market (2017-07-25)
In this quarter, the share of TSMC revenue from 10-nm products will increase dramatically (2017-07-15)
Release of 7-nm processors Qualcomm will be TSMC, not Samsung (2017-06-14)
TSMC believes that the three-dimensional arrangement of chips will extend the operation of Moores law (2017-06-12)
TSMC already chooses a place for the construction of a factory that will manufacture 3-nm products (2017-06-09)
TSMC will release a new type of memory (2017-06-06)
TSMC promises a more functional 7-nm process technology than Samsung (2017-05-27)
AMD will attract for the release of 7-nm products TSMC and GlobalFoundries (2017-05-19)
The immediate and long-term plans of Samsung and TSMC for the implementation of the next technical processes (2017-05-07)
TSMC will introduce EUV-lithography in the late version of 7-nm process technology (2017-04-25)
TSMC lowered the forecast for the development of the contract chip market in 2017 (2017-04-15)
TSMC plant in Nanjing will be able to produce 16-nm semiconductors (2017-04-09)
In the second half of the year will be the installation of equipment at the Chinese plant TSMC (2017-03-25)
Samsung is ahead of TSMC in the production of 10-nm chips (2017-03-23)
TSMC outperformed Intel in terms of capitalization (2017-03-23)
The new TSMC enterprise in the US can start producing 3-nm products (2017-03-21)
TSMC needs Toshiba Assets to access the memory technologies such as 3D NAND (2017-03-03)
TSMC intends to begin 5-nm production in 2019 (2017-02-26)
Another earthquake led to a short stop two factories TSMC (2017-02-14)

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