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 - Intel Alloy virtual reality helmet that does not require a PC and external sensors - Cool 1 Dual the first joint smartphone Coolpad LeEco and Dual Camera - Intel also wants to bury the headphone jack in its current form - New Android-smartphone Oppo certified TENAA -


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POSTER: computer news   ||   INTEL ALLOY VIRTUAL REALITY HELMET THAT DOES NOT REQUIRE A PC AND EXTERNAL SENSORS

DATE:2016-08-17

In an interview with the founder of Oculus VR Palmer Lucky  admitted that ideally a virtual reality helmet should not only work without a wired connection, but also  manage their own computing resources.  

Intel company took up the dream of Palmer Lucky, because at IDF 2016 processor giant introduced Project Alloy - an open platform for application development of virtual and augmented reality that uses RealSense camera to recognize gestures and surrounding real-world objects.  In fact, Project Alloy - it is only the reference product, based on which the company's customers will be able to create their own versions of helmets of virtual reality.  Their products appear on the market before the second half of next year.

 

 

The advantages of the Project Alloy, Intel considers not only the availability RealSense cameras can measure the change of coordinates in six axes without the use of external sensors, but also a complete computing autonomy.  The device does not require connection to a computer, as based on the very Skylake processor, and has sufficient computing resources.

RealSense cameras help to avoid collisions with objects of the real world as you move through the virtual world.  Furthermore, they can be employed to track the hand movements and handling technology "augmented 'reality.  Detailed characteristics of the device were not disclosed.  

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Intel Alloy virtual reality helmet that does not require a PC and external sensors

Intel Alloy virtual reality helmet that does not require a PC and external sensors

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INTEL ALLOY VIRTUAL REALITY HELMET THAT DOES NOT REQUIRE A PC AND EXTERNAL SENSORS

POSTER: computer news   ||   COOL 1 DUAL THE FIRST JOINT SMARTPHONE COOLPAD LEECO AND DUAL CAMERA

DATE:2016-08-17

As planned, on August 16,  was submitted the first adjoint smartphone LeEco and Coolpad .  It was named Cool Dual 1 and represents the flagship model, complete with double main camera.  

Smartphone Dual Cool 1 has a 5.5-inch IPS-display with a resolution of 1920x1080 pixels, 8-megapixel front camera and the battery capacity of 4060 mAh.  It is based on  SoC Qualcomm Snapdragon 652 platform, which consists of four core Cortex-A53 clocked at 1.2 GHz quad-core Cortex-A72 clocked at 1.8 GHz and graphics Adreno 510. The memory volume is 3 or 4 GB, depending the version.

Special attention is given a double main camera, similar to that used in Huawei P9.  It includes two 13-megapixel sensors, one of which is monochrome and the other is - color.  According to LeEco, the new camera features high clarity and brightness, as well as a good suppression of digital noise when shooting in low light conditions.  double two-tone flash supplemented main camera and can record video in 4K format.

Cool 1 Dual clad in slim metal body, on the back side of which in addition to a dual camera with flash is a fingerprint reader.

In China sales Dual Cool 1 will start on 26 August.  The choice of buyers offer three models.  The cost of low-end model with 3 GB of RAM and 32 GB of internal memory will be 1099 yuan , while the version with 4 GB of RAM and 32 GB of internal memory will cost customers 1499 yuan  .The older version with 4 GB of RAM and a built-in storage to 64 GB will be available at the price of 1699 yuan .

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Cool 1 Dual the first joint smartphone Coolpad LeEco and Dual Camera

Cool 1 Dual the first joint smartphone Coolpad LeEco and Dual Camera

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COOL 1 DUAL THE FIRST JOINT SMARTPHONE COOLPAD LEECO AND DUAL CAMERA

POSTER: computer news   ||   INTEL ALSO WANTS TO BURY THE HEADPHONE JACK IN ITS CURRENT FORM

DATE:2016-08-17

Apple hsd intentions to remove the 3.5-inch headphone jack in favor of a single connector Lightning for future   iPhone 7 and iPhone 7 Plus.

Notorious socket size 3.5 headphones "migrated to mobile devices even with the cassette player, and cause manufacturers  a lot of inconvenience. Firstly,  the nest requires sufficient space inside the device. Second, analog harness connector generates an interference affecting the operation of adjacent electronic . Finally, components, digital sound control could significantly improve the usability of compatible headphones - for example, if we replace the 3.5-inch type "C" connector USB port.

 

The latter allows  not only to charge the battery or mobile device to transfer information, but also to connect the smartphone to a monitor or TV to view video.  Furthermore, USB plug of type "C" can be inserted into the slot either side, turning 180 degrees.  The sound in digital form is much easier to manage: You can apply a variety of acoustic effects, control volume and playback, use active noise cancellation technology.  On the level of energy consumption in the USB connector headphone translation type "C" will have no significant effect, according to Intel representatives  .  Preliminary specifications of the new standard for the transmission of sound through the USB will be published later this quarter.

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Intel also wants to bury the headphone jack in its current form

Intel also wants to bury the headphone jack in its current form

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INTEL ALSO WANTS TO BURY THE HEADPHONE JACK IN ITS CURRENT FORM

POSTER: computer news   ||   NEW ANDROID-SMARTPHONE OPPO CERTIFIED TENAA

DATE:2016-08-17

The new smartphone Oppo visited the Chinese certification center TENAA communication equipment.  It is indicated on TENAA website as Oppo R9km, which suggests that we face a new version of the Oppo R9 , or its successor.  

Unfortunately, TENAA database has no information on the technical characteristics of the new smartphone Oppo R9km.  It reported only that it support of 4G LTE and two SIM-cards and runs on Android mobile operating system running.  

 

According to GizmoChina, Oppo R9S instead of MediaTek Helio P10 from Oppo R9 receive a Qualcomm Snapdragon 625 chip with Adreno 506 graphics produced on 14-nanometer process technology.  The smartphone will be supported by LTE Cat.7 and fast charging technology Super VOOC, that Oppo has demonstrated in February at the MWC 2016 conference in Barcelona.  It allows you to fully charge the 2500 mAh battery in just 15 minutes and make up 45% charge is possible in 5 minutes of charging.  Oppo R9S will be one of the first smartphones preloaded with the latest operating system Android 7.0 Nougat.  

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New Android-smartphone Oppo certified TENAA

New Android-smartphone Oppo certified TENAA

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NEW ANDROID-SMARTPHONE OPPO CERTIFIED TENAA

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