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 - HIS has introduced its own version of the Radeon RX 460 and RX 470 - Micron will not rush to 3D XPoint memory advancement in client PC - Intel says goodbye to Broadwell processors in LGA 1150 - Some information about the characteristics of AMD Zen engineering samples -


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POSTER: computer news   ||   HIS HAS INTRODUCED ITS OWN VERSION OF THE RADEON RX 460 AND RX 470

DATE:2016-08-10

HIS company introduced from two own versions of Radeon RX 460 and the RX 470 graphics cards.  Older cards differ only by operating frequencies .  

The video card HIS RX 460 iCooler the OC , as stated above, is available in two versions: with 2 and 4 GB of GDDR5 memory , which works with the effective frequency 7000 MHz.  The GPU in both versions received a small factory overclock and works at a frequency up to 1220 MHz (Boost).  The video card is made on a non-reference PCB and is equipped with a 6-pin connector for additional power supply, but, unfortunately, the details about the device itself is not the power system.  

Video cards HIS-RX 470 IceQ X2 OC and RX 470 X2 Turbo IceQ , in addition to the names are different from each other only by the frequency of the graphics processor in Boost mode, which is in 1226 and 1256 MHz, respectively.  Both cards come with 4 GB of GDDR5 memory with effective frequency 7000 MHz.  Each of HIS RX 470 IceQ X2 performed on the non-reference PCB and is equipped with 8-pin power connector.  Details of the power system manufacturer does not specify.  The updates to the cooling system used IceQ X2 with a pair of fans, a large aluminum heatsink and three copper heatpipes.

All of the above video is already available for pre-order in the UK .  The video card HIS-RX 460 iCooler OC 2 memory rated at 100 pounds, and HIS-RX 470 IceQ X2 OC and RX 470 IceQ X2 Turbo - 180 and 189 pounds, respectively.

 

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HIS has introduced its own version of the Radeon RX 460 and RX 470

HIS has introduced its own version of the Radeon RX 460 and RX 470

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HIS HAS INTRODUCED ITS OWN VERSION OF THE RADEON RX 460 AND RX 470

POSTER: computer news   ||   MICRON WILL NOT RUSH TO 3D XPOINT MEMORY ADVANCEMENT IN CLIENT PC

DATE:2016-08-10

As is known, in the creation and production of new types of solid-state memory  Micron company works closely with Intel - they even have a profile joint venture.  And if Intel activity allows consumers to see how expanding the range of products of the joint venture,  Micron activity usually remains in the shadows.  Above all, this is due to the specialization Micron in the corporate market.  For the retail segment has a brand Crucial, as well as products more distant partners.

This month, the company Micron has told on the pages of its blog about the intentions to bring to market a family of QuantX solutions that use memory type 3D XPoint, and colleagues with the Computerworld website published the comments of Vice President Micron John Carter, allowing to get an idea of the company's Intent this area.  First of all, Carter said about the presence of Micron's own timetable for the withdrawal of products on the market on the base of 3D XPoint.

 

Let's start with the fact that Intel is about to begin shipments of SSDs based on the type of memory 3D XPoint until the end of the year , and Micron says only the beginning of the second quarter  2017 as the appropriate boundary.  And only in the second half of 2017 revenues from sales of storage family QuantX reach barely noticeable quantities.  By 2019, Micron is going to reach break-even in this kind of products.  By the way, the representative of Micron makes it clear that Intel products and the corresponding class in reality will only appear on the market in 2017.

Carter explains that the first year of issue on the basis of 3D XPoint devices will not be the easiest.  First of all, due to limited production capacity and strong demand from corporate clients.   Micron will satisfy the needs of server segment in the first place.  

In general, 3D XPoint positioning is such that the memory of this type will be twice cheaper than  DRAM, but four or five times more expensive than NAND.  

In the next six months, Micron is going to announce the cooperation with the partners, who will be releasing products based on the 3D XPoint.  Given that the focus on the market of desktop and mobile systems, the company is not considered reasonable, we can say with certainty about the direction of this cooperation on the market for corporate decisions.  By the way, Carter regrets about the preparations for the 3D XPoint release was announced back in 2015.  Consumers eventually got the impression that the yield of products based on this technology is delayed.  Intel and Micron expect in the coming years to control 20-30% of the market, although they are aware that Samsung is preparing a rival technology.

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Micron will not rush to 3D XPoint memory advancement in client PC

Micron will not rush to 3D XPoint memory advancement in client PC

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MICRON WILL NOT RUSH TO 3D XPOINT MEMORY ADVANCEMENT IN CLIENT PC

POSTER: computer news   ||    INTEL SAYS GOODBYE TO BROADWELL PROCESSORS IN LGA 1150

DATE:2016-08-10

The owners of motherboards with LGA 1150 were waiting for a long meeting with the first 14-nm Intel processors, after Broadwell exit had to admit that the range of offerings is limited to two models (Core i7-5775C and Core i5-5675C), which are not inconsiderable ($ 366 and $ 276), they are equipped with the most graphics performance available for Intel desktop processors - Iris Pro graphics 6200. the low level of energy consumption in this situation is somehow did not stand out against the background of other features.

The combination of qualities was a bit too strange to justify the continued presence of Broadwell processors on the market, especially after the release of the full Skylake line.  There is nothing surprising in the fact that this week, Intel has issued a notice of impending termination of  Core i7-5775C and Core i5-5675C processors deliveries.

 

 

The reason for the termination of deliveries in this case is obvious - indeed demand has shifted to other Intel products.  Order Broadwell processors will be until 24 February 2017, and the last party will be dispatched on 11 August 2017.  This applies to both the boxed version and versions in the OEM-set.  We add that the processors Broadwell-E in LGA 2011-3 will be delivered, and further action on them this notice does not apply.

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Intel says goodbye to Broadwell processors in LGA 1150

 Intel says goodbye to Broadwell processors in LGA 1150

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INTEL SAYS GOODBYE TO BROADWELL PROCESSORS IN LGA 1150

POSTER: computer news   ||    SOME INFORMATION ABOUT THE CHARACTERISTICS OF AMD ZEN ENGINEERING SAMPLES

DATE:2016-08-10

As we know, AMD company intends to present desktop processors Summit Ridge first among all carriers of  Zen architecture, and therefore appropriate engineering samples are spreading not only at industry events.

"German search engines" in the pages offline Planet3DNow.de posted information about the mention of engineering sample AMD Summit Ridge (Zen) in the code of CPU-Z utility.  It is reported that this pattern is marked type 1D2801A2M88E4_32 / 28_N.  

It explains that it is a desktop processor with eight cores, clocked at 2.8 / 3.2 GHz.  Of course, this does not mean that the serial processors Summit Ridge will not receive frequencies over 3.2 GHz.  Prior to the announcement of processors a few months, the frequency potential may improve.  Moreover, as we know , among processors and Summit Ridge will be models with TDP level not more than 65 W, and it is unlikely they will shine the maximum permissible for the family  frequencies.

 

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Some information about the characteristics of AMD Zen engineering samples

 Some information about the characteristics of AMD Zen engineering samples

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SOME INFORMATION ABOUT THE CHARACTERISTICS OF AMD ZEN ENGINEERING SAMPLES

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