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 - One of the versions ZTE Nubia X8 will get a Snapdragon 823 platform - Large Pascal will be released no earlier than the first quarter of 2017 - AMD can change the address of the headquarters - Samsung shares plans about 14-nm process and 10 nm technology -


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POSTER: computer news    ||   ONE OF THE VERSIONS ZTE NUBIA X8 WILL GET A SNAPDRAGON 823 PLATFORM

DATE:2016-04-26

The first rumors about the smartphone ZTE Nubia X8 has been around for a very long time, almost a year ago, after which regularly appeared some information about the device.  And now another portion of rumors about the smartphone has appeared on the web.  

Here are the main specifications of each version  Nubia X8:

 

  • The basic version will be Snapdragon 820, 3GB of RAM and 32GB   internal memory, a display with a resolution 1920 x 1080 pixels;
  • Average Snapdragon version will be 820, 4 GB RAM and 32/64 GB internal memory, a display with a resolution 2560 x 1440 pixels;
  • The flagship version will get a Snapdragon 823, 6GB RAM and 128/256 GB internal memory, a display with a resolution 3840 x 2160 pixels.

All three versions of the smartphone will have a diagonal of 6.44 inches displays.  Note that in addition to the data on the characteristics smartphone leaked promotional image of the smartphone, which can be said about the presence of a dual-LED flash in the main camera and a fingerprint scanner on the back of the metal case.

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43952 Rating: 10.0/10 (7 votes cast)


One of the versions ZTE Nubia X8 will get a Snapdragon 823 platform

One of the versions ZTE Nubia X8 will get a Snapdragon 823 platform

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ONE OF THE VERSIONS ZTE NUBIA X8 WILL GET A SNAPDRAGON 823 PLATFORM

POSTER: computer news   ||   LARGE PASCAL WILL BE RELEASED NO EARLIER THAN THE FIRST QUARTER OF 2017

DATE:2016-04-26

Debut of GPU GP100 with Pascal architecture led many to question the validity of its  identity as a segment of graphics solutions: in fact, OEM-customers will receive this processor as part of accelerators Tesla computing only the first quarter  next year, and at the end of this new product will be available only to  supercomputers producers and "cloud" systems.

However the Czech colleagues explained that the GP100 will be a part of the gaming graphics cards.  It is only necessary to have patience.

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43951 Rating: 10.0/10 (6 votes cast)


Large Pascal will be released no earlier than the first quarter of 2017

Large Pascal will be released no earlier than the first quarter of 2017

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LARGE PASCAL WILL BE RELEASED NO EARLIER THAN THE FIRST QUARTER OF 2017

POSTER: computer news   ||    AMD CAN CHANGE THE ADDRESS OF THE HEADQUARTERS

DATE:2016-04-26

Sale of real estate - common action among  companies in need of working capital.  So did many Japanese manufacturers.

According to TweakTown site, occupied by AMD headquarters building from 1977 in Sunnyvale, California, will  be soon replaced  , and  AMD  agreement expires in December 2018.  In conjunction with the desire to optimize costs after redundancy, according to sources, it could push the company to find another building to house the headquarters.

AMD representatives declined to comment on the rumors, but pointed out that even a change of owner occupied its headquarters building will not force the company to look for a new location.  

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AMD can change the address of the headquarters

 AMD can change the address of the headquarters

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AMD CAN CHANGE THE ADDRESS OF THE HEADQUARTERS

POSTER: computer news   ||   SAMSUNG SHARES PLANS ABOUT 14-NM PROCESS AND 10 NM TECHNOLOGY

DATE:2016-04-26

Last week appeared information about Samsung's plans to improve the technical processes for the production of semiconductors.  Samsung  rarely shares  plans, so the weight of this information can not be overestimated.  Let's start with the fact that Samsung will offer customers 14-nm process technology with reduced production costs - 14LPC FinFET.  For the development of chips within 14LPC process technology will be used the same design tools, as for the 14-nm process technology second generation - 14LPP (Low-Power Plus).  The number of processing cycles for the production of chips 14LPC reduced, but not at the expense of  performance.  In other words, the cost of  chips will be smaller and  frequency potential will not be affected.

Mass production of chips within the technical process 14LPC starts this year.  By the end of the year in this technical process will be able to produce radio-frequency inductor-type components, thus paving the way for the integration of radio modules in the SoC crystals.  Samsung has put on the market more than 500 thousand Wafers with chips.  It is already well-functioning production with very low levels of defects - 0.2  per square.  cm.

In addition to the 10 nm process technology LPE (Low-Power Early) company immediately prepares the mate - nm process technology 10 LPP (Low-Power Plus).  Process technology 10LPP promises 10% better performance than the technical process 10LPE.  There are already rumors that the 10-nm process technology  Samsung second generation, which include 10LPP, will be embedded into mass production before the end of this year.  .  Developers this year will save time and will quickly get the products with the best performance.

The company also reported that the development is carried out 7-nm process technology 7LPE.  Samsung Company for the production of critical layers will almost certainly use the advanced EUV-scanners with a wavelength of 13.5 nm.  Such a scenario is also seen in TSMC company , while Intel is against the use of EUV-scanners configured negatively.   Samsung's argue the necessity of partly go to of EUV-projection in that for the production of 7-nm chips using 193-nm scanners take three mask (and three processing cycle) for each layer, as it will increase the number of photomasks  60 to 90 pieces, that unreasonably expensive.

Improving technical processes will be followed not only by reducing the projection scale  .  Samsung can continue to develop the 28-nm process technology.  In particular, the 28-nm process chip production on a fully depleted FD-SOI wafers will be added ability to integrate flash memory and radio frequency components.  The company will continue to offer customers the production of chips on 200-mm wafers on the process from 180 nm to 65 nm.  Such decisions will have all the modern extension of integrated flash memory, the RF-components, sensors and more.  According to the Samsung, it will help to "satisfy a chip famine in regions in need of advanced semiconductors."

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Samsung shares plans about 14-nm process and 10 nm technology

Samsung shares plans about 14-nm process and 10 nm technology

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SAMSUNG SHARES PLANS ABOUT 14-NM PROCESS AND 10 NM TECHNOLOGY

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