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 - Head of Intel telephone unit leaves the company - Microsoft integrates into the Windows 10 operating system Ubuntu - Intel introduced a new solid-state drives on 3D NAND chips - iPhone SE will not be able to compensate for the iPhone 6s sales fall -


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POSTER: computer news   ||   HEAD OF INTEL TELEPHONE UNIT LEAVES THE COMPANY

DATE:2016-04-02

According to unofficial information,  Intel company lost a valuable management training.  According to the news agency Bloomberg, resignation filed Aisha Evans - Head of Communication and Devices Group.  In total some weeks ago, Ms. Aisha in Barcelona at Mobile World Congress advertised telephone Intel's platforms and solutions for networks of the 5th generation  mobile communication!  What is particularly interesting, as head of division Aisha Evans worked for less than a year.

The publication is particularly emphasize that this is not very pleasant for the company event took place against the background of rumors about Intel's agreement to supply modems to Apple's iPhone.  A number of respected analysts believe that Intel will soon replace Qualcomm modem from the list of suppliers for smartphones and Apple tablet.  

Aisha Evans joined Intel company in 2006.  Previously, she has worked at Rockwell Semiconductors companies, Conexant and Skyworks Solutions Inc  ..  Her departure from Intel - is loss of reputation.  

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Head of Intel telephone unit leaves the company

Head of Intel telephone unit leaves the company

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HEAD OF INTEL TELEPHONE UNIT LEAVES THE COMPANY

POSTER: computer news   ||    MICROSOFT INTEGRATES INTO THE WINDOWS 10 OPERATING SYSTEM UBUNTU

DATE:2016-04-02

Microsoft entered into a partnership agreement with Canonical company , which is the official developer of the Ubuntu operating system.  In the released cooperation in this Windows 10 operating system  will be integrated Debian GNU / Linux.  In this solution the functionality is not limited to only one terminal, , Ubuntu will run in parallel with without the use of virtual machines.  As expected, the integration of subsystems from Canonical will be held under the new Windows 10 build to developers.

It should be noted that this is not the first step of the Redmond company made towards Linux.  Previously, the company has already collaborated with Canonical as an extension for Windows features LXD-use containers, as well as to help developers create programs for Ubuntu, using Azure cloud technology.  

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Microsoft integrates into the Windows 10 operating system Ubuntu

 Microsoft integrates into the Windows 10 operating system Ubuntu

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MICROSOFT INTEGRATES INTO THE WINDOWS 10 OPERATING SYSTEM UBUNTU

POSTER: computer news   ||    INTEL INTRODUCED A NEW SOLID-STATE DRIVES ON 3D NAND CHIPS

DATE:2016-04-01

In addition to  Intel Xeon processor E5-2600 v4, Intel today introduced Intel the SSD DC P3320 and P3520 - the first SSD with a multilayer   memory 3D NAND.  Compared with a single-layer memory NAND memory chips, these are pleased benefits including improved speed (1.3 times, according to Intel), better fault tolerance, higher energy efficiency and improved data integrity mechanisms.

Drives Intel SSD DC P3320 and P3520 are focused on use in data centers and cloud repositories.  They used 3D NAND memory chips, which operate in the TCL operation and support NVMe protocol.  The drives are made in versions with 450 GB, 1.2 TB and 2 and are available both in the form factor 2.5-inch u.2, and in the form of expansion cards PCIe 3.0 x4 (only the last two).

Performance Intel SSD DC P3320 and P3520 SSDs in reading random blocks reaches 365,000 IOPS, and  recording - 22,000 IOPS.  sequential read speeds of up to 1600 MB / s and write - 1400 MB / s.  Although Intel has not yet sounded the cost of these drives, it will be relatively low.

Also presented  the drives Intel SSD DC D3600 and D3700 in the conventional memory type NAND MLC.  These new products are the first Intel SSDs connect simultaneously to two host controllers (two ports PCI Express) and support NVMe 1.2 protocol.  

D3600 drive is available in versions with capacity of 800 GB and 1.6 TB, and D3700 - 1 and 2 TB.  These drives have a read speed of random blocks of 470,000 IOPS, and records - 95 000 IOPS.  sequential read speed is 2100 MB / s and write - 1500 MB / s.  

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Intel introduced a new solid-state drives on 3D NAND chips

 Intel introduced a new solid-state drives on 3D NAND chips

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INTEL INTRODUCED A NEW SOLID-STATE DRIVES ON 3D NAND CHIPS

POSTER: computer news   ||   IPHONE SE WILL NOT BE ABLE TO COMPENSATE FOR THE IPHONE 6S SALES FALL

DATE:2016-04-01

iPhone SE Sales can not compensate for the drop in demand for the iPhone 6s and iPhone 6s Plus in the second quarter  2016.  In the second quarter, which began today and will end in June, iPhone SE Delivery will be from four to five million units.  By the way, Apple has in January during the announcement of the quarterly results of financial investors warned that the first quarter of 2016 may occur first in the last 13 years, falling incomes.  But the exact financial indicators Apple for the past three months we will know only 25 of April, when held a traditional press conference with Apple CEO Tim Cook.

ChipWorks experts  meanwhile carefully studied all the chips that are installed inside the 4-inch iPhone SE, then we came to the conclusion that its stuffing really looks more like the iPhone 6s, than iPhone 5s.  According to 9to5Mac, the iPhone from 6s  received A9 processor with a M9 coprocessor , the same memory capacity of 2 GB LPDDR4, NFC-chip NXP 66VIO, 6-axis inertial sensor and modem Qualcomm MDM9625M.  It is noteworthy that the marking on the chip RAM indicates that it was made in August / September 2015.  This could mean that originally, these memory modules are designed for 4.7-inch iPhone 6s.  In the studied ChipWorks iPhone SE-off is also set internal flash drive capacity of 16 GB, released by Toshiba.  IPhone 5s inherited touchscreen controllers Broadcom BCM5976 and Texas Instruments 343S0645, due to the lack of sensitivity of both smartphones to the pressing force.  Function 3D Touch, we recall, was the distinguishing feature of the iPhone 6s and iPhone 6s Plus.

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iPhone SE will not be able to compensate for the iPhone 6s sales fall

iPhone SE will not be able to compensate for the iPhone 6s sales fall

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IPHONE SE WILL NOT BE ABLE TO COMPENSATE FOR THE IPHONE 6S SALES FALL

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