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 - Apple fined 8 billion for tax evasion in Europe - ECS H110SU-02 form factor Mini-STX - TSMC expects to get more market share - Huawei P9 schematic representation -

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Apple, may have to pay more than $ 8 billion in taxes in Europe.  It is reported by the authoritative edition of Bloomberg.

According to journalists, as a result of investigation of the European Commission against Apple and its tax policies of major US companies could be fined more than $ 8 billion. In particular, the Commission found that the company used a subsidiary company registered in Ireland for tax on income generated outside the United States.  

The European Commission argues that corporate collusion in Ireland, Apple expects profits and taxes by using more favorable for her accounting practices.  In calculating taxes Apple indicates lower operating costs, thereby reducing the amount of taxes to the treasury of Ireland.  Despite the fact that about 55% of its revenue Apple generates outside of the US, its foreign tax rate is about 1.8%.  If the European Commission against Apple will choose a harder standard tax accounting, the company will have to pay 12.5% of the $ 64.1 billion in profits earned from 2004 to 2012.

Apple company , according to the Bloomberg, is going to appeal against the decision of the European Commission.

By the way, previously chief executive of Apple CEO Tim Cook has denied that the company uses a variety of tricks to avoid paying high taxes.  In a recent interview with reporters CBS, commenting on criticism of US lawmakers to the company, he said that the US tax system is outdated and needs to be updated in view of the current economic situation, including the market of digital technology.

A spokesman for Apple Hyuget Christine And a representative of the European Commission, Ricardo Cardoso declined to comment on the information.


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Apple fined 8 billion for tax evasion in Europe

Apple fined 8 billion for tax evasion in Europe

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POSTER: computer news   ||   ECS H110SU-02 FORM FACTOR MINI-STX


ECS company , as well as a few other manufacturers, too, decided to experiment with a new form factor motherboards offered by Intel.  This so-called size Mini-STX with the side of the board 140 x 147 mm.  

Thus, ECS.  At CES 2016 showed H110SU-02  on Socket LGA 1151 processors , the maximum power consumption of the CPU board 65 watts.  The board is equipped with an external power supply power 90 W (19 V).

The memory system is represented by two SoDIMM slots for memory DDR4.  In the presence of a single port SATA 6Gb / s and two slots M.2.  One full-length for the SSD (2280), and the second is shorter - for Wi-Fi-module, for example (2230).  Platform  - a chipset Intel H110 / B150.  The integrated network adapter card to the appropriate port.  USB ports are represented by a single port USB 3.1 Type-C and two ports USB 3.0.  Video ports - one HDMI port and one port DisplayPort.  

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ECS H110SU-02 form factor Mini-STX

ECS H110SU-02 form factor Mini-STX

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In recognition of the company's management TSMC, in 2015, it is equally shared production market of 14/16-nm chips with Samsung.  In 2016, the company is going to do everything possible to take from  Samsung its market share and reshape the market contracts in their favor with a score of 70:30.  To do this, the Taiwanese contractor is going to, at least, to increase capital expenditure in 2016 to $ 9.10 billion. Much of this money will be put on the expansion of the share of the 16-nm solutions production.  In the past year, we note TSMC company  lowered capital expenditures to a record low value - to $ 8.1 billion. This was due to a decrease in the company's income, but in 2016 the company expects to see revenue growth, which will allocate to the development of additional amounts.

For example, TSMC company  expects an 8% increase production solutions for smartphones, focusing on the platforms higher and secondary productivity.  The company also completed the development of a special version of the 16-nm process technology - 16nm FinFET Compact (16nm FFC).  This process technology for low-power chips - for wearable electronics and items for connecting to the Internet.  In principle, TSMC has identified three priorities: high-end smartphones, supercomputers (obviously talking about NVIDIA Pascal) .

Separately, TSMC company  has confirmed plans to move to the next processes.  Verification of 10-nm process is almost completed, and client design chips using it will begin in the current quarter.  Process technology with the norms of 7 nm will be put into production in 2017, and the technical process with the norms of 5 nm - in 2019.   


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TSMC expects to get more market share

TSMC expects to get more market share

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After the release of Mate 8, Huawei took the finalization of the smartphone P9.  Prior to the announcement of the successor to P8 there is not much time, so there are more rumors and leaks regarding this smartphone.  

Huawei P9 get physical "Home" button below the display, which certainly accommodate the fingerprint scanner - otherwise hard to explain the  sudden appearance.  On the back of the smartphone we see a system of two chambers, and dual LED flash.  On the bottom side of the device, in addition to the port USB (yet unknown what exactly), is the speaker and 3.5mm headphone jack.  Side frame smartphone is made of metal.  

Specifications Huawei P9, according to previous rumors, will include a 5.2-inch display with a resolution of 1920 x 1080 pixels, SoC platform Kirin 950, dual-core camera with a resolution of 12 megapixels and a battery capacity of 3000 mAh.  The smartphone is likely to be presented at the exhibition MWC 2016, which will be held in late February in Barcelona, and novelty sales will begin in March.

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Huawei P9 schematic representation

Huawei P9 schematic representation

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