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 - Next week NVIDIA will get a chance to talk about Volta - overclocking dual-processor Radeon HD 4870X2 - The immediate and long-term plans of Samsung and TSMC for the implementation of the next technical processes - Deepcool unveiled a maintenance-free FPGA Captain EX RGB with a multi-colored backlight -


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POSTER: computer news   ||    NEXT WEEK NVIDIA WILL GET A CHANCE TO TALK ABOUT VOLTA

DATE:2017-05-07

Next week promises to be very interesting for those who follow NVIDIA activities  .  First of all, tomorrow the GPU Technology Conference will begin its work, with more than six hundred speeches, including the speech of the founder of NVIDIA, on the agenda .  He, by the way, will arrive at the event only on Wednesday, before making a report at the quarterly reporting conference.  And it is difficult to say which of these two events will be a more suitable place for important revelations.

While on the GPU Technology Conference website we managed to find the only mention of the graphics processors with the Volta architecture, and even in the context of the Summit supercomputer construction, where they will be used to speed up the calculations and communicate with IBM processors using the NVlink interface.  The launch of the supercomputer is scheduled for the end of 2018, and full-scale operation will begin only in 2019.  In this context, it is much more important that SK Hynix has already promised to begin to provide memory of the type GDDR6 from 2018 to one of the developers of graphics solutions, in a description very similar to NVIDIA.  The CEO of the company often uses industry events in May to form the right expectations for his future products.

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Next week NVIDIA will get a chance to talk about Volta

 Next week NVIDIA will get a chance to talk about Volta

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NEXT WEEK NVIDIA WILL GET A CHANCE TO TALK ABOUT VOLTA

POSTER: computer news   ||   OVERCLOCKING DUAL-PROCESSOR RADEON HD 4870X2

DATE:2017-05-07

 Traktor started overclocking the dual-processor veteran Radeon HD 4870X2 with the help of a self-made liquid cooling system.

The frequencies of the video card  managed to raise to 852/3774 MHz, and the central processor Core i7-7700K with the help of the phase transition system was overclocked to 5.7 GHz.

The first three places was in favorite series of tests 3DMark Ice Storm.

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48593 Rating: 10.0/10 (2 votes cast)


overclocking dual-processor Radeon HD 4870X2

overclocking dual-processor Radeon HD 4870X2

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OVERCLOCKING DUAL-PROCESSOR RADEON HD 4870X2

POSTER: computer news   ||    THE IMMEDIATE AND LONG-TERM PLANS OF SAMSUNG AND TSMC FOR THE IMPLEMENTATION OF THE NEXT TECHNICAL PROCESSES

DATE:2017-05-07

Over the past two months, Samsung and TSMC have made a number of announcements that helped clarify the plans of both manufacturers to introduce the latest and next technology for the production of semiconductors.  At one time, we talked about almost all the news on this topic .  Recently, an article appeared on the site of AnandTech, in which the author brings together information on the possibilities of the newest technical processes of both companies, which allows us to return to this issue and generalize the available data in free access.

Let's start with Samsung, which has been releasing 10-nm chips for about half a year using the 10LPE process technology.  According to the recent recognition of Samsung, about 70 thousand plates with 10-nm solutions are produced.  This is neither much nor little, but clearly better than the situation with the release of 10-nm solutions by TSMC.  At the same time, the company produces virtually (and only) two 10-nm solutions: Exynos 9 Octa 8895 and Qualcomm Snapdragon 835 - both for the Samsung Galaxy S8.

Compared to the 14LPP process technology, the Samsung chips using the 10LPE process technology are 30% smaller, consume 40% less energy (provided the same clock frequency and design complexity are maintained) and are ready to show a 27% gain in frequency The same level and with the same design complexity).  In parallel, Samsung has completed the development and qualification of the second generation 10-nm process technology - 10LPP (low-power plus) - and is ready to start manufacturing chips with its use at the end of 2017.

The third generation of the process technology - 10LPU - will be introduced for the production of semiconductors at the end of 2018.  Samsung does not give figures to compare the 10LPU and 10LPP process technology, but the gain in switching from 10LPE to 10LPP (from the first generation to the second generation) is already indicated (all the data in the table above).  So, while maintaining the level of consumption by frequency, you can add up to 10%.  If you fix the clock frequencies, you can achieve a reduction in consumption by up to 15%.  And although Samsung has not yet planned to produce SoC with the use of 10LPU and 14LPC process technologies (close in purpose), we see that in each generation of the technological process there are now three stages of production.  Actually, Intel did the same thing when it extended the use of the 14-nm process technology to the third generation of processors.

TSMC company , according to it assurances, began production of 10-nm solutions (technical process CLN10FF) in the second quarter, but in practice the process of qualifying the technical process at its two factories: GigaFabs 12 and 15, has hardly ended. A really mass release of solutions will begin in the second half of the current of the year.  Until the end of the year, TSMC is going to release up to 400 thousand plates with 10-nm chips.  As the company is driven by Apple's orders for SoC for new smartphones, TSMC does not have much time to build.  But it should not fail.

I must say that the transition from the CLN16FF + process technology (second generation 16 nm) to the CLN10FF process technology promises to significantly improve SoC parameters.  So, the density of transistors will increase by more than 50%, the performance with the same consumption and complexity will grow by 20%, and consumption will decrease by 40% if you keep the same clock frequency.  Unlike Samsung, by the way, TSMC is not going to "produce" a 10-nm process technology and intends to move on to the first generation of 7-nm process technology (CLN7FF), which has already been enthusiastically received by many unskilled developers.

It is interesting to note that TSMC originally planned to present two versions of the 7-nm process technology: one for high-performance solutions, and the second for mobile.  Both of them were oriented to immersion lithography using 193-nm scanners.  Now the company expects to launch first the first generation of "common" 7-nm process technology using traditional equipment, and then introduce the second generation 7-nm process technology with the partial use of EUV-scanners for the production of critical layers.  The company GlobalFoundries will follow the same route.

The stage of risk production using the technical process CLN7FF company TSMC will begin in the current quarter.  Mass production of solutions on the technical process CLN7FF should start in the second quarter of 2018.  In commercial products, the first 7-nm TSMC chips will be in the second half of 2018.  If we compare the technical processes CLN16FF + and CLN7FF, the designers will be able to reduce the area of ??crystals to 70%, reduce the consumption to 60% or increase the clock speed to 30%.

Production using the second-generation 7-nm process technology (CLN7FF +) and EUV-scanners will further reduce the area of crystals (by 10% to 20%), and improve performance or reduce consumption.  Also, switching to partial use of EUV lithography will shorten the production cycle, which will reduce the price load on chips (reduce the cost of production).  Risk production using the technical process CLN7FF + is expected in the second quarter of 2018, and mass commercial - in the second half of 2019.  At similar times, EUV scanners are also counted by GlobalFoundries and Samsung, which gives us confidence in the sufficient maturity of EUV lithography.

In addition to the 7-nm process technology, which was some surprise, in March, Samsung announced that it intends to introduce 8-nm and 6-nm process technology.  Technological processes with the norms of 8 nm and 6 nm will become successors, respectively, 10-nm and 7-nm process technology.  This means that the 8-nm process technology will remain on 193-nm scanners, and the 6-nm process technology will get more layers using EUV-scanners.  By the time you can expect that the commercial production of 8-nm solutions will begin in 2019 - six months before the commercial launch of the first 7-nm solutions Samsung.  The release of 6-nm solutions, respectively, is expected later - at the turn of 2020-2021.

All the above technological processes use vertical (FinFET) transistors.  At the same time, this process technology is still not available to the mainstream developers.  It is quite expensive and difficult to design.  An alternative to the FinFET process technology should be the 22-nm process technology TSMC and 22/28-nm process technology companies GlobalFoundries and Samsung using plates FD-SOI.  All with the use of planar transistors.

The TSMC CLN22ULP process technology is an optimized process technology of the latest generation at 28 nm.  Using 22ULP will reduce the area of the crystal by 10% and raise the clock speed by 15% or reduce the consumption by 35%.  Subsequently, TSMC will introduce the 12-nm process technology CLN12FFC, which will be the result of the development of the 16-nm process CLN16FFC (compact).  This step will ensure a reduction in the crystal area by 20%, an improvement in the frequency potential by 10%, or a decrease in consumption by 25%.  This will happen approximately in 2018 or 2019.  Apparently, even if Moore's law ceases to be valid, it will not be boring.

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The immediate and long-term plans of Samsung and TSMC for the implementation of the next technical processes

 The immediate and long-term plans of Samsung and TSMC for the implementation of the next technical processes

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THE IMMEDIATE AND LONG-TERM PLANS OF SAMSUNG AND TSMC FOR THE IMPLEMENTATION OF THE NEXT TECHNICAL PROCESSES

POSTER: computer news   ||    DEEPCOOL UNVEILED A MAINTENANCE-FREE FPGA CAPTAIN EX RGB WITH A MULTI-COLORED BACKLIGHT

DATE:2017-05-06

Deepcool company recently introduced new processor-free, maintenance-free liquid cooling systems called Captain EX RGB, which technically are no different from the previously released Captain EX coolers, except that their pumps are equipped with a non-monochrome backlight and a customizable RGB backlight.  To control the backlight is a special switch, which allows you to adjust the mode, brightness and speed.  Or, when connected to a compatible motherboard (with Asus Aura and similar technologies), the backlight can be controlled using the proprietary utility of the motherboard.

 

Maintenance free Deepcool Captain EX RGB will be available in versions with 120- and 240-mm radiators, with one or two 120-mm fans, respectively.  New products are compatible with all modern processor connectors Intel and AMD, including Socket AM4.  A water block combined in one housing with a pump is connected to the radiator using flexible tubes 310 mm in length.  The new products use fans, which can rotate at a speed of 500 to 1800 rpm, while their noise level is 17.6 - 31.3 dBA.

New maintenance-free liquid cooling systems Deepcool Captain EX RGB will go on sale next month, and their recommended cost is $ 100 and $ 130 for versions with a 120- and 240-mm radiator, respectively.  By the way, in addition to the SZHO, the kit includes one RGB-LED strip for the case.

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Deepcool unveiled a maintenance-free FPGA Captain EX RGB with a multi-colored backlight

 Deepcool unveiled a maintenance-free FPGA Captain EX RGB with a multi-colored backlight

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DEEPCOOL UNVEILED A MAINTENANCE-FREE FPGA CAPTAIN EX RGB WITH A MULTI-COLORED BACKLIGHT

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