- NZXT Kraken G12 solution for cooling the memory of video card equipped with a water block - IBM developed the best insulators for 7-nm process technology - Moto C and Moto C Plus characteristics - Foxconn ready to throw cash in Toshiba just to get the assets for the release of memory -

	xtreview is your : Video card - cpu - memory - Hard drive - power supply unit source

POSTER: computer news   ||   NZXT KRAKEN G12 SOLUTION FOR COOLING THE MEMORY OF VIDEO CARD EQUIPPED WITH A WATER BLOCK	DATE:2017-04-12
The waterblocks that focus on cooling only the GPU are more versatile in terms of compatibility.  True, their application generates a new problem: if the regular air cooling system of the video card still somehow cares about memory chips and power cells, then a compact water block makes the user think of it.   NZXT brand is ready for almost $ 30 to offer the Kraken G12 adapter, which allows to fix an additional 92-mm fan in the vicinity of memory chips and power elements when installing a compact water block on a graphics processor. At first glance, it resembles the casing of a conventional air-cooling system of a video card, but an empty hole is provided for placing a water block on the graphics processor, and the adapter basket itself is in its working position with its "bottom" deployed to the printed circuit board. This adapter is compatible with water blocks and non-serviced FOSS from several manufacturers: Specifications NZXT Kraken G12 and a list of compatible video cards are mentioned below: Select Rating : Currently 10.00/10 1 2 3 4 5 6 7 8 9 10 48334 Rating: 10.0/10 (6 votes cast) NZXT Kraken G12 solution for cooling the memory of video card equipped with a water block	Add Comment ( 1 ) NZXT KRAKEN G12 SOLUTION FOR COOLING THE MEMORY OF VIDEO CARD EQUIPPED WITH A WATER BLOCK

POSTER: computer news   ||    IBM DEVELOPED THE BEST INSULATORS FOR 7-NM PROCESS TECHNOLOGY	DATE:2017-04-12
This week at the IEEE International Reliability Physics Symposium (IRPS) symposium, a representative of IBM made a report on the creation of insulating materials with better properties than the current insulators of silicon nitride (SiN).  Two new materials in its composition except silicon and nitride contain either carbon and boron (SiBCN), or oxygen and carbon (SiOCN).  In the case of using SiN insulators, IBM believes, the parasitic capacitance will account for up to 85% of the total chip capacity.  The transition to SiBCN and SiOCN films will significantly reduce this negative factor and will provide an opportunity to increase the productivity and energy efficiency of future solutions. To assess the performance of new insulating materials for the 22-nm process technology, the company used an insulator 10 nm thick.  For an experimental 7-nm chip, the thickness of the insulator is reduced to 6 nm.  Interestingly, the practical implementation of new insulating materials is planned not only for the 7-nm process technology, but also for the current 14-nm process technology on the lines of GlobalFoundries.  Thus, as an option, we can wait for a refined 14-nm process technology with AMD solutions with better characteristics.  In the production of 5-nm semiconductors, IBM developers expect to use an absolute insulator-air gaps. Another factor for increasing the parasitic capacitance at IBM is the edge unevenness of the connecting conductors (line edge roughness, LER).  Using the example of a high-precision mathematical model, IBM showed that increasing the edge unevenness leads to the growth of parasitic capacitance, so this factor must be learned to compensate. Select Rating : Currently 10.00/10 1 2 3 4 5 6 7 8 9 10 48333 Rating: 10.0/10 (5 votes cast) IBM developed the best insulators for 7-nm process technology	Add Comment ( 1 ) IBM DEVELOPED THE BEST INSULATORS FOR 7-NM PROCESS TECHNOLOGY

POSTER: computer news   ||   MOTO C AND MOTO C PLUS CHARACTERISTICS	DATE:2017-04-12
This year we are waiting for the announcement of several new smartphones under the brand Moto.  Among them will be Moto C and Moto C Plus, the technical characteristics of which have already leaked to the Network. Moto C, according to GSMArena with reference to Evan Blass, will be equipped with a 5-inch display with a resolution of 854 x 480 pixels, a 5-megapixel main and a 2-megapixel front camera, each of which has a separate flash, as well as 1 GB of RAM.  Autonomous work smartphone will provide a battery capacity of 2350 mAh. Moto C will be released in two versions.  3G-model will receive a 32-bit four-core processor MediaTek with a clock speed of 1.3 GHz, 8 GB of internal memory and a main camera with a fixed focus.  And the version with 4G will be equipped with a 64-bit quad-core MediaTek processor with a clock speed of 1.1 GHz, a built-in 16 GB storage device and a rear camera with autofocus.  Both models will be endowed with support for memory cards format MicroSD. Moto C will be joined by a slightly more powerful Moto C Plus.  It will have a 5-inch display with a resolution of 1280 x 720 pixels, 16 GB of internal memory, a slot for microSD cards and a pair of cameras: 8-megapixel main and 2-megapixel frontal.  Its heart will be a 64-bit quad-core MediaTek processor, supplemented with 1 or 2 GB of RAM (depending on the region).  Moto C Plus will receive support for 4G LTE and will be powered by a 4000 mAh battery. Moto C and Moto C Plus will be offered in several colors, including black, white, gold and red. Select Rating : Currently 10.00/10 1 2 3 4 5 6 7 8 9 10 48332 Rating: 10.0/10 (5 votes cast) Moto C and Moto C Plus characteristics	Add Comment ( 1 ) MOTO C AND MOTO C PLUS CHARACTERISTICS

POSTER: computer news   ||   FOXCONN READY TO THROW CASH IN TOSHIBA JUST TO GET THE ASSETS FOR THE RELEASE OF MEMORY	DATE:2017-04-11
The Chinese giant Hon Hai Precision Industry, better known by the Foxconn trademark, already has the experience of "taking Japanese asset sellers from scratch", since after lengthy negotiations and a series of scandals surrounding the terms of the deal, still managed to take control of the Japanese corporation Sharp - , For the opportunity to receive "on favorable terms" liquid crystal panels for mobile devices and televisions.  In conditions where the latter are in short supply, the "right of the first wedding night" for the Chinese giant of the electronics industry may not be superfluous. The Wall Street Journal , citing informed sources, reports that Foxconn is offering at least $ 27 billion for Toshiba's solid-state memory assets, and the closest competitor is only $ 18 billion. It is known that Chinese investors are not favorites of this race in terms of Japanese authorities who attribute to Toshiba the possession of some "strategically important technologies."  However, when it comes to money, national interests can recede into the background - for Toshiba it is now very important to cover their losses and restore the credibility of creditors, because the money obtained from the sale of the NAND-type memory business will end sooner or later, and it will be necessary to take new  Loans. Along the way, Reuters reports that Vestel, the Turkish manufacturer of television equipment, has confirmed its own interest in acquiring Toshiba's TV business, which focuses on the domestic market of Japan.  These assets are needed by the Turkish company to strengthen its position in the international market.  Negotiations are still underway, but it's too early to talk about their success. Select Rating : Currently 10.00/10 1 2 3 4 5 6 7 8 9 10 48331 Rating: 10.0/10 (16 votes cast) Foxconn ready to throw cash in Toshiba just to get the assets for the release of memory	Add Comment ( 1 ) FOXCONN READY TO THROW CASH IN TOSHIBA JUST TO GET THE ASSETS FOR THE RELEASE OF MEMORY

	xtreview is your : Video card - cpu - memory - Hard drive - power supply unit source

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