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 - Xiaomi will not take part in the exhibition MWC 2017 - Western Digital Corporation promises magnetic recording technology heating before 2019 - 3DMark03 a new record - Ford offers a formal telematics device to OBDII port -


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POSTER: computer news   ||    XIAOMI WILL NOT TAKE PART IN THE EXHIBITION MWC 2017

DATE:2017-01-27

February 27 in Barcelona starts annual international exhibition Mobile World Congress (MWC 2017) mobile electronics.  The leading electronics manufacturers, including  LG ,  Samsung,  Sony , Huawei's , LeEco ,  HMD (brand the Nokia ) and TCL (brand BlackBerry ).  But the Chinese company Xiaomi will miss the upcoming exhibition, what GizmoChina reported, with reference to the representative of Xiaomi.

Xiaomi spokesman said that this year the company will not be present at the MWC show in Barcelona.  This decision came as a complete surprise to everyone, and what exactly it is connected, is not specified.  Earlier it was expected that at the MWC 2017 the company will present its new flagship Xiaomi of Mi6 .  

According to one version, Xiaomi has refused to participate in the MWC 2017 in connection with the departure of vice-president Hugo Barra .  As it became known yesterday, Hugo Barra takes the post of vice-president of the social network Facebook and will manage projects in the field of virtual reality.  But it is possible that the reason lies on the delay of supply of processor Qualcomm Snapdragon 835, which will form the basis of Xiaomi Mi6.

By the way, recently Xiaomi CEO Lei Jun said that the company grew too fast and now after the rapid growth came  the transition period.  In the past year, according to IHS, Xiaomi has put all 58 million smartphones, taking fourth place among Chinese manufacturers after Huawei, Oppo and Vivo.  So, Huawei smartphones in 2016 have sold 139 million copies, Oppo smartphone - the 95 millionth edition.   Vivo during the reporting period has sold 82 million smartphones.

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Xiaomi will not take part in the exhibition MWC 2017

 Xiaomi will not take part in the exhibition MWC 2017

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XIAOMI WILL NOT TAKE PART IN THE EXHIBITION MWC 2017

POSTER: computer news   ||   WESTERN DIGITAL CORPORATION PROMISES MAGNETIC RECORDING TECHNOLOGY HEATING BEFORE 2019

DATE:2017-01-27

Back in December last year, Western Digital Corporation has promised to investors "gold mountain" described exemplary milestone introduction of new technologies in the segment of storage on a hard disk.  In particular, it has long developed technology of magnetic recording heated (HAMR), which provides heating portion of the magnetic plate before recording information with a laser must be used in mass-produced products in 2019.  A year earlier, the technology will be implemented "two-dimensional" magnetic recording (TDMR), and multi-spindle drives may appear to the end of the decade.

In the reporting quarter conference by representatives of Western Digital Corporation stated that they see no reasons why the magnetic recording technology heating may be on the market before 2019.  They call to realize that even the absence of technical obstacles to the early commercialization of this technology still does not give reason to expect acceleration of the process.  It is important to offer customers a proven technology with high reliability and at the right price.  Now the economic factor still can not talk about this technology is ready for implementation, therefore, will have to wait until 2019.

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Western Digital Corporation promises magnetic recording technology heating before 2019

Western Digital Corporation promises magnetic recording technology heating before 2019

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WESTERN DIGITAL CORPORATION PROMISES MAGNETIC RECORDING TECHNOLOGY HEATING BEFORE 2019

POSTER: computer news   ||   3DMARK03 A NEW RECORD

DATE:2017-01-27

American enthusiast Splave set new record in 3DMark03, but still finished third in the absolute standings with a score of 350,332 points.

NVIDIA Graphics Card Titan X generation Pascal was overclocked with the help of liquid nitrogen to 2200/12008 MHz,.  The CPU Core i7-7700K (Kaby Lake) with the help of liquid nitrogen was overclocked to 6953 MHz, and  it retained the activity of all four cores but HT was disabled.

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3DMark03 a new record

3DMark03 a new record

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3DMARK03 A NEW RECORD

POSTER: computer news   ||    FORD OFFERS A FORMAL TELEMATICS DEVICE TO OBDII PORT

DATE:2017-01-27

Now seeking telematic services of car owners there are several ways to achieve this goal.  You can use the service functions security complex.  You can fork out for a new car with built-in functionality like unlocking doors or start the engine with a smart phone.  Finally, you can install a special attachment to the OBDII diagnostic connector, and at the same time get access to many of the onboard computer menu, as well as diagnostic information, with a special program.

According to CNet website of Ford decided to take a piece of bread for the third-party telematics devices, and introduced a product called the SmartLink, which will expand the service capabilities onboard car brands Ford and Lincoln systems under 2010 release.  The device comprises a GPS-receiver and LTE-modem, which is set in the standard diagnostic connector OBDII.  Network infrastructure provides the US Verizon network operator that similar devices for vehicles of different brands already offers.

You can get information about the car using a smartphone application or apply on the corporate portal through a browser.  Specialized site owner not only reveal diagnostic information, but also to offer immediately to make an appointment in the service for eliminating or preventing the identified faults.  You can collect statistics on driving style and get recommendations for reducing fuel consumption.  

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Ford offers a formal telematics device to OBDII port

 Ford offers a formal telematics device to OBDII port

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FORD OFFERS A FORMAL TELEMATICS DEVICE TO OBDII PORT

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