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 - Devices with Microsoft voice assistant will be released in 2017 - UMi Z the first smartphone-based on 10-core processor Helio X27 - ELSA shared the secrets of Graphics cards manufacture - Samsung may separate the business of manufacturing semiconductor devices -


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POSTER: computer news   ||   DEVICES WITH MICROSOFT VOICE ASSISTANT WILL BE RELEASED IN 2017

DATE:2016-12-15

Amazon Fresh, experience has shown that third-party developers have willingly take advantage of open access to the company's tools to create interesting devices that support corporate voice assistant Alexa.  For some six months entered the market a variety of devices with support for Amazon Alexa.  Anyway, a few days ago, Microsoft has made available  the two packages for developers with support for Cortana assistant: Cortana Skills Kit package for the integration of Cortana software and Cortana Devices SDK to create devices with support for Cortana.

The first tool Cortana Devices SDK, developers have taken advantage of Harman Kardon .  According to a Microsoft spokesperson, a clever speaker Harman Kardon with Cortana support will be available in 2017.  It can be expected that the new product will be shown for the first time in two weeks at the January exhibition CES 2017. The company also hopes that next year there will be a variety of devices with support for Cortana.

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Devices with Microsoft voice assistant will be released in 2017

Devices with Microsoft voice assistant will be released in 2017

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DEVICES WITH MICROSOFT VOICE ASSISTANT WILL BE RELEASED IN 2017

POSTER: computer news   ||   UMI Z THE FIRST SMARTPHONE-BASED ON 10-CORE PROCESSOR HELIO X27

DATE:2016-12-15

As expected, on UMi company this week unveiled its new flagship called UMi the Z .  It became the first smartphone based on the new 10-core chip the MediaTek the Helio the X27 , which was announced in early December.

UMi Z is a top-end smartphone Helio X27.  In addition to the new processor MediaTek it also sports a 13-megapixel rear camera with Samsung sensor, laser and phase detection autofocus and flash, 13-megapixel front with a separate flash to create quality selfie even in low light conditions.  The battery capacity of 3780 mAh provides UMi new smartphone up to 15 days of battery life in standby mode.  It supports fast charging technology Pump Express +

UMi Z is the first smartphone UMi, dressed in an all-metal body.  two narrow plastic inserts are available for the signal.  The smartphone will come with pre-installed Android 6.0 Marshmallow, but the company promises will soon update UMi Z to Android 7.0 Nougat.

Technical specifications UMi Z:

 

  • Screen is 5.5 inches, IGZO-panel production Sharp, 1920 x 1080 pixels, 401ppi, protective Dragontrail glass effect 2.5D;
  • SoC: MediaTek Helio X27 (MT6797X), dual-core Cortex-A72 cores and eight Cortex-A53, a 64-bit architecture,  maximum clock frequency of 2.6 GHz, graphics controller Mali-T880MP4;
  • Memory: 4 GB RAM and 32 GB of built-in slot for MicroSD memory cards (up to 256GB);
  • Camera: 13-megapixel front Samsung S5K3L8 with LED-flash Softlight, 13-megapixel main Samsung S5K3L8 a five-component lenses, LED-flash of the four light-emitting diodes, phase autofocus, laser autofocus and support for recording 4K-video;
  • Operating system: Android 6.0 Marshmallow with the option to upgrade to Android 7.0 Nougat;
  • Battery capacity: 3780 mAh, quick charge Pump Express +;
  • Other: a fast fingerprint scanner Touch ID 2.1, USB Port Type-C, 3,5-mm audio jack, Wi-Fi, Bluetooth 4.1, FM-radio, GPS / GLONASS, support for two SIM-cards (hybrid slot);
  • Case: aluminum, 8.2 mm thick, 175 g,
  • Available colors: gray and gold.

 UMi Z presales is scheduled for 29 December.  Price : $ 279.99.

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UMi Z the first smartphone-based on 10-core processor Helio X27

UMi Z the first smartphone-based on 10-core processor Helio X27

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UMI Z THE FIRST SMARTPHONE-BASED ON 10-CORE PROCESSOR HELIO X27

POSTER: computer news   ||   ELSA SHARED THE SECRETS OF GRAPHICS CARDS MANUFACTURE

DATE:2016-12-15

Focusing on the durability of graphics cards,  ELSA continues to give preference to plain bearings in the cooling system of its products.  As you know, they have lower noise levels, but quickly lose their performance properties.  According to ELSA representatives , in recent years the industry has learned to do long-lasting bearings, picking up grease composition, the hub structure and its processing technology.  Moreover, in the video card series GLADIAC the company uses a cooling system with two fans, each of which is equipped with its own type of bearing.  One of the fans provided a slide bearing, the other - a hybrid variant that uses a ball bearing structural elements.  If one of the bearing fails, the second fan will ensure tolerable cooling conditions .

 

ELSA is proud of the fact that equips the graphics card with metal covers of the cooling system.  Security of operation is given close attention: the rough edges smoothed to protect your hands from injury .  

ELSA is skeptical to the idea of fans  stop at a light load on the GPU .  It prefers to reduce the fan speed, but leave them in the work always with the computer turned on.  Generally,  ELSA so carefully check the finished product, even a scratch on the shell size of greater than 1 mm video card may cause the return of the finished product contract manufacturer, which is located in China.  Strict control over the quality of video cards makes ELSA return to the contractor to half of all finished products.

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ELSA shared the secrets of Graphics cards manufacture

ELSA shared the secrets of Graphics cards manufacture

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ELSA SHARED THE SECRETS OF GRAPHICS CARDS MANUFACTURE

POSTER: computer news   ||   SAMSUNG MAY SEPARATE THE BUSINESS OF MANUFACTURING SEMICONDUCTOR DEVICES

DATE:2016-12-15

A few years ago, AMD has separated the assets for the production of semiconductor devices, gradually turning GlobalFoundries as an independent company with financial support from Arab investors. After entering the market of contract manufacturing of semiconductor products GlobalFoundries had the opportunity to attract third-party orders, increasing economic returns. South Korean edition of Business Korea reports that Samsung Electronics is considering the restructuring of System LSI Division, which is now engaged and the development and production of processors and chipsets. It is assumed that the production line is highlighted in a separate structural unit. Developers of microprocessors, on the contrary, will be consolidated from disparate teams in Samsung structure. It is alleged that the impetus for the adoption of such a decision has served Apple transition to TSMC services for contract manufacturing of processors for mobile devices. The loss of a major customer Samsung forced to think about the business reorganization and improving its economic efficiency. We add that Samsung will actively assist in the development of GlobalFoundries 14-nanometer technology, and now Qualcomm, the company received a contract to produce 10-nm processors. Even for NVIDIA Samsung has found a custom - the second of the companies produces graphics for the first 14-nm processors GP107, used in video cards GeForce GTX 1050 series .

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Samsung may separate the business of manufacturing semiconductor devices

Samsung may separate the business of manufacturing semiconductor devices

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SAMSUNG MAY SEPARATE THE BUSINESS OF MANUFACTURING SEMICONDUCTOR DEVICES

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