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 - AMD Head talk about mining - Processors AMD Ryzen will be registered in commodity laptops for the New Year holidays - Western Digital Announces Memory Technology for 3D NAND with 4-Bit Cell - AMD over 7-nm products there are several teams of specialists -


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POSTER: computer news   ||   AMD HEAD TALK ABOUT MINING

DATE:2017-07-26

In the prepared part of the speech at the quarterly AMD reporting conference, the company's management managed to avoid actively discussing the topic of mining, but when analysts poured out profile questions, it was impossible to remain silent.  To begin with, the head of AMD once again called the supply of graphics solutions for gaming enthusiasts its main task, and the growth in demand for video cards from the side of "miners", she considers a temporary phenomenon.

However, Lisa Su made it clear that the company can not ignore the growth in demand for video cards due to a crypto currency boom, and is trying to increase the volume of output of graphics solutions - though not thoughtlessly, but with operational feedback.  While talking about eliminating the shortage of video cards early, because retail stocks are small, according to AMD head  .

Lisa Su admitted that she helps partners to create special versions of video cards for miners, without video output.  Thus, a certain segmentation of the market is achieved.  However, the head of AMD considers it necessary to declare that mining is not considered as a medium-term factor that ensures revenue growth.  AMD does not include the effect of "crypto-currency booms" in its forecasts, although it does not deny that mining has come into our lives for a long time, and it will no longer be ignored.  Another thing is that the surge in demand for video cards can be temporary.  

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AMD Head talk about mining

AMD Head talk about mining

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AMD HEAD TALK ABOUT MINING

POSTER: computer news   ||    PROCESSORS AMD RYZEN WILL BE REGISTERED IN COMMODITY LAPTOPS FOR THE NEW YEAR HOLIDAYS

DATE:2017-07-26

Her speech at the quarterly report conference, the head of AMD Lisa Su, began by listing the main stages of bringing new products to the market.  This month should begin selling Ryzen 3, will be announced Radeon RX Vega on SIGGRAPH 2017, and Ryzen Threadripper will go on sale in early August.  Systems based on Ryzen PRO processors for corporate clients will appear until the end of the current quarter, but the company has traditionally blurry about the timing of the appearance of hybrid mobile processors Ryzen (Raven Ridge) by the end of this year.

In this sense I got rid of only a direct question from one of the analysts who was addressed to the head of the company.  Lisa Su had to admit that AMD partners will offer laptops based on mobile processors Ryzen for the season of New Year sales, until the end of this year.  At the same time, she did not specify that it was the Raven Ridge processors with the Vega graphics system, but she emphasized that the entire line of Ryzen processors will be presented this year.  If you consider that Raven Ridge is also included in it, then it certainly was about laptops based on hybrid processors with the Zen architecture.

By the way, it is the mobile processors of previous generations that spoil AMD's statistics in the segment of client devices.  The average price of their sales in the past quarter decreased, and the situation was saved only by desktop processors Ryzen, which raised the average price of AMD processor implementation by double-digit percentage.  The number of mobile processors sold increased.  In other words, AMD began to sell more cheap processors for laptops.

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Processors AMD Ryzen will be registered in commodity laptops for the New Year holidays

 Processors AMD Ryzen will be registered in commodity laptops for the New Year holidays

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PROCESSORS AMD RYZEN WILL BE REGISTERED IN COMMODITY LAPTOPS FOR THE NEW YEAR HOLIDAYS

POSTER: computer news   ||    WESTERN DIGITAL ANNOUNCES MEMORY TECHNOLOGY FOR 3D NAND WITH 4-BIT CELL

DATE:2017-07-26

In recent years, the cost of storing data on solid-state drives has dropped to a tolerable level, which allows you to safely buy an SSD to replace hard drives of the initial capacity.  While this applies to SSD capacity up to 256 GB.  Storage capacity of more than 512 GB will stop beating most users in the next couple of years.  An important role in this promises to play multi-layer memory with the recording of several bits in each cell.  While 3D NAND memory is produced with the recording of two (MLC) and three (TLC) bits per cell.  The next cell with four bits is QLC.  During the period of planar NAND memory, the memory with the QLC cell was released in limited quantities for memory cards and USB-drives.  With the beginning of the 3D NAND era, a four-bit cell promises to penetrate all spheres of solid-state drive life.

At once we will tell that it is not necessary to be frightened to fast deterioration of memory with multilevel record.  Yes, to write four bits into one cell, the memory controller must distinguish between 16 levels of signal (charge) in each cell.  Obviously, the load on the controller will increase.  Also, the load on the ECC-block restoring the data will increase.  All this will increase latency when accessing QLC memory.  As for wear and tear, here is not so simple.  Planar memory in its development reached the technical process of 15 nm and stopped, because the cell became so small that the number of electrons in it could no longer be enough to record a 16-level signal.  Multilayer memory started from the technological processes of 40-30 nm.  In each 3D NAND cell, the storage space for the charge is six times larger than in the most advanced 2D NAND memory.  Recording a 16-level QLC signal will be reliable and with a guarantee to withstand many more erase cycles than in the case of planar memory.  We can say, we are waiting for the flow of QLC memory and further decrease in the cost of data storage on the SSD.

When will this happen?  The application for the release of 3D NAND QLC a month ago was made by Toshiba.  At the end of June, the manufacturer announced that samples of a 64-layer 3D NAND BiCS3 QLC with a capacity of 768 Gb (96 GB) are ready.  If 16 such chips are packaged in a single case - to release a single-case SSD, which manufacturers make more than one five-year plan, you will get a 1.5-TB drive with the size of a small postage stamp.  This is definitely impressive.  Mass release of such memory will begin, most likely, only next year.  The developer does not specify the dates, but it's unlikely to be drawn with this.

Western Digital reported about the development of 3D NAND memory technology with a 4-bit cell.  As we well know, Western Digital is working on the memory of 3D NAND QLC together with Toshiba.  In fact, the company showed everything the same as Toshiba a month ago, only replaced the inscription on the case of the chip.  The conventional designation is 3D NAND BiCS3 X4.

It should be noted that some of the inscription in the designation hinted at the roots that go down in the history of SanDisk.  The pioneer in developing the technology of recording three and four bits in one cell is Israeli company M-Systems.  At one time, it introduced the appropriate technology X3 and X4.  In 2006, SanDisk bought M-Systems and all the patents that belonged to it.  It seems that some of these developments surfaced in the technology of 3D NAND BiCS3 X4 production.  In any case, Toshiba can not be considered an exclusive developer of 3D NAND BiCS3 X4 memory.

 

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Western Digital Announces Memory Technology for 3D NAND with 4-Bit Cell

 Western Digital Announces Memory Technology for 3D NAND with 4-Bit Cell

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WESTERN DIGITAL ANNOUNCES MEMORY TECHNOLOGY FOR 3D NAND WITH 4-BIT CELL

POSTER: computer news   ||   AMD OVER 7-NM PRODUCTS THERE ARE SEVERAL TEAMS OF SPECIALISTS

DATE:2017-07-26

Recently, the chief technologist and technical director of AMD, in an interview with one industry resource, admitted that the transition to a 7-nm process technology will require significant costs, and that his company intends to use it throughout the life cycle of several consecutive generations of products.  At least in the segment of processors on 7-nm technology will be produced and products with the architecture of Zen 2, and their successors Zen 3. Company's contractors will master EUV-lithography no earlier than 2019, and this critical moment for the whole industry will also fall on the "era 7-nm process technology. "

At the quarterly report conference Lisa Su only stressed that the 7-nm process technology will play a key role in the production of both central and graphics processors, and they will be produced by several contractors.  And if you can talk about the involvement of Samsung in this group of partners mainly theoretically, then TSMC and GlobalFoundries will be attracted exactly .

AMD CEO notes, then mastering the 7-nm process technology is going well.  Parallel work is carried out by several teams of specialists, and this allows Liza Su to believe that several subsequent generations of AMD products will have high competitiveness.

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AMD over 7-nm products there are several teams of specialists

AMD over 7-nm products there are several teams of specialists

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AMD OVER 7-NM PRODUCTS THERE ARE SEVERAL TEAMS OF SPECIALISTS

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