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 - New Meizu Android-smartphone with a curved display and dual camera - Huawei P10 receive ultrasonic fingerprint scanner - Huawei is working on a 10-nm processor Kirin 970 - Renesas is ready to become a leader in the segment of automotive microelectronics -


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POSTER: computer news   ||   NEW MEIZU ANDROID-SMARTPHONE WITH A CURVED DISPLAY AND DUAL CAMERA

DATE:2016-11-24

In addition to Meizu Pro 7 ,  Meizu company is preparing to release another smartphone.  

Meizu smartphone is dressed in a metal case with plastic inserts for the antennas and  like Meizu Pro 7, equipped with a dual-core camera and Home button oval with integrated fingerprint reader.  And one of the main features of the new smartphone Meizu will be curved at the edges touch screen.

 

Earlier, it was announced that Meizu Pro 7 will be equipped with a processor Samsung Exynos 8890 and MediaTek Helio X30 and dual 12-megapixel main camera.  

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New Meizu Android-smartphone with a curved display and dual camera

New Meizu Android-smartphone with a curved display and dual camera

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NEW MEIZU ANDROID-SMARTPHONE WITH A CURVED DISPLAY AND DUAL CAMERA

POSTER: computer news   ||   HUAWEI P10 RECEIVE ULTRASONIC FINGERPRINT SCANNER

DATE:2016-11-24

Chinese sources have published new photos of Huawei P9 successor.

 Huawei P10 in black and white colors.  Judging by the photos, Huawei's next flagship will receive a Home button sensor with built-in ultrasonic fingerprint scanner.

Also, the sources of published press photos Huawei P10, confirming that the new flagship will come in two versions.  One of them received the flat-panel display, and the other - a curved screen like the Huawei Mate 9 Porsche Design and Galaxy S7 edge.  Both models will be equipped with dual rear camera.

According to rumors, Huawei P10 will be based on the latest processor Kirin 960 with 4 GB of RAM, and will receive a 5.5-inch screen with a resolution Quad HD (2560 x 1440 pixels).  Announcement Huawei P10 is expected in April 2017, a year after the announcement of Huawei P9.

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Huawei P10 receive ultrasonic fingerprint scanner

Huawei P10 receive ultrasonic fingerprint scanner

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HUAWEI P10 RECEIVE ULTRASONIC FINGERPRINT SCANNER

POSTER: computer news   ||   HUAWEI IS WORKING ON A 10-NM PROCESSOR KIRIN 970

DATE:2016-11-24

Huawei company, introduced in October chip Kirin 960 , is already working on a next flagship CPU for mobile devices.  The new single-chip platform, as one would expect, dubbed Kirin 970.

According to PhoneArena the edition, Kirin 970 will show a great leap forward in terms of performance compared to the Kirin 960. The structure of the new single-chip platform will include Huawei eight cores and an integrated "global LTE-modem.  

Kirin 970 will be built on 10-nanometer rules, while Kirin 960 as Kirin 950, made on 16-nanometer FinFET process technology.  

The debut of the new chip Kirin 970 expected in 2017.  It must compete with the new 10-nanometer processors, Samsung, Qualcomm and MediaTek.

Recall,  Kirin 960 includes a quad-core Cortex-A73, quad-core Cortex-A53 with big.LITTLE architecture, graphics accelerator Mali-G71 MP8 and LTE-modem LTE Cat.12 / 13 support.  Its effectiveness compared with Kirin 950 increased by 15%.

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Huawei is working on a 10-nm processor Kirin 970

Huawei is working on a 10-nm processor Kirin 970

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HUAWEI IS WORKING ON A 10-NM PROCESSOR KIRIN 970

POSTER: computer news   ||   RENESAS IS READY TO BECOME A LEADER IN THE SEGMENT OF AUTOMOTIVE MICROELECTRONICS

DATE:2016-11-24

The bottom of a personal crisis, the Japanese company Renesas passed in 2013, and in 2015 became a tasty morsel for investors .  Strictly speaking, the "Mobile Giant" Qualcomm's NXP acquired the assets for similar reasons , because the Americans were interested in Freescale development in the segment of automotive microelectronics.

Renesas Representatives in an interview with EE Times said that while competitors had planned mergers and acquisitions, the Japanese company managed to increase its presence in the segment of automotive microelectronics.  At the end of 2015 calendar year,  Renesas in terms of revenue controlled 47% of the components of the market "in the vicinity of the instrument panel", and 44% of the market "instrumental" solutions that work under the hood and in other vehicle systems.  Renesas is now actively engaged in the promotion of platforms suitable for the creation of automotive autopilot and other active driver assistance systems.  The company is determined to oust MobilEye - one of the leading developers of components for automotive systems "machine vision".  

Renesas believes that the cars need a system with a high degree of integration, combining a large number of specialized cores and subsystems.  Perhaps they do not have the computing power of CPUs, but the power consumption allows us to speak about the efficiency of the car.  For comparison, the specialized processor can recognize Renesas three and a half in the second image, but consume only 0.22 watts.  

 

Renesas Developers already offers its reference platform R-Car M3 and R-Car H3 is priced at $ 499 and $ 755, respectively.  The latter uses the most advanced processor Renesas today - RH850, which specializes in typical autopilot problems. According to Renesas representatives  , "complete autopilot" can be realized by using two modules R-Car H3.  Software development is carried out in a Linux environment, and the company pays special attention to compatibility and continuity.

Now RH850 is available on the 40-nm process at TSMC.  In the future, the processor will be transferred to the 28-nm technology.  image recognition accuracy of Renesas platforms has already reached 98.8%.  Clients from among the automakers are actively interested Renesas platforms to create robocar and electric vehicles.  According to the Japanese company, today fixed assets are invested not in the development of power plants and transmission and to the creation of an active driver assistance systems.  In the next 20 years the number of  software code lines used advanced models of cars will increase by 300 times.  Renesas is ready for the challenge and is open to cooperation with new partners.

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Renesas is ready to become a leader in the segment of automotive microelectronics

Renesas is ready to become a leader in the segment of automotive microelectronics

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RENESAS IS READY TO BECOME A LEADER IN THE SEGMENT OF AUTOMOTIVE MICROELECTRONICS

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