Many experts concur in the opinion, that in spite of complex economic climate, semiconductor microcircuit producers will sooner or later be forced to turn to the use of silicic plates standard size 450 mm, which will allow to increase the production volumes and to reduce the prime cost of the output units. Certainly, the realization of last advantage is very far, since producers will be forced to build new factories.
According to the data of the analytical report semico research, the transition probability to the use of 450 mm plates considerably grew recently. Economic crisis moved aside the introduction periods of 450 mm plates, but in the long-term passage to their use is practically inevitable. According to the forecasts of TSMC representatives, for example, mass production of chips with the use of silicic plates 450 mm diameter will start in about 2015.
Demand for electronics will be growing; therefore, producers are forced to increase power. At some moment, it will be more advantageous to build one factory, which uses 450 mm plate, then two factories, which process 300 mm plate. Now this theme actively studies Intel, Samsung and TSMC.
Passage to the 450 mm standard could become alternative to the radically new technology of microcircuit production.