Micron has developed a low-profile memory modules for ultrabooks

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POSTER: computer news   ||   MICRON HAS DEVELOPED A LOW-PROFILE MEMORY MODULES FOR ULTRABOOKS	DATE:2013-02-09
Micron company presented its new development : low-profile single-memory type DDR3 SODIMM performed exclusively as solution for ultrabooks, tablets and convertible mobile devices that require the minimum case  thickness. Optimized memory module DDR3 chips are placed on one side only, and designed by TE Connectivity SODIMM low-profile design reduces the height by one third compared to the other terminals.   It must be said that the proposed one-way low profile Micron DDR3 memory module can be installed in conventional connectors SODIMM.  The modules are available in versions with 4 GB. Micron will begin mass production of its low-profile memory modules in spring this year.   Related Products :

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