Canadian colleagues site Hardware Canucks more than a month ago, published a review of the processor Core i7-5960X, and were those rare lucky that Intel representatives openly reported on the use of solder as the thermal interface between the crystal Haswell-E and the heat spreader. Furthermore, the same source explains that used in Haswell-E solder efficient in terms of thermal conductivity than the polymer thermal interface new generation, used in processors Devil's Canyon .
Participants of the forum XtremeSystems.org with reference to the documentation from Intel and comments from the company explained that the use of solder as the thermal interface necessitates metallization surface of silicon processors Haswell-E, but it is not the most simple and cheap operation process technology package. Accordingly, in Bulk processors it does not apply for reasons of economy, but bordering on the server segment Haswell-E lucky in this sense. Series processors Devil's Canyon are too small, so they got an advanced polymeric thermal interface, not the solder. Related Products :
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