TSMC has introduced a technology platform for handheld devices and Internet things

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POSTER: computer news   ||   TSMC HAS INTRODUCED A TECHNOLOGY PLATFORM FOR HANDHELD DEVICES AND INTERNET THINGS	DATE:2014-09-30
TSMC company has introduced a new technology platform to create solutions with ultra-low power and a wide range of applications.  In particular, it is called a segment of the Internet of things and wearable electronics.  Through the platform TSMC offers several processes with different design standards. For example, to customers will be available technologies 55ULP, 40ULP and 28ULP (ultra-low power, ultra-low power) with topological respectively 55, 40 and 28 nm, which will complement the range of previously existing processes - 0.18eLL (180 nm, extremely low leakage currents) 90uLL (90 nm ultra-low leakage currents) and 16 nm FinFET. Compared to the previous version of the process category ULP new technology can reduce the operating voltage of chips by from 20% to 30% and, consequently,  reduce power consumption.  For portable devices, for example, this means significantly increased operating time from the battery. TSMC reports that the new technology will be used in production from 2015. Related Products :

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