Fujitsu has developed a new type of heat pipe for smartphones

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POSTER: computer news   ||   FUJITSU HAS DEVELOPED A NEW TYPE OF HEAT PIPE FOR SMARTPHONES	DATE:2015-03-15
Japanese company Fujitsu cooling module based on the flat heat pipe can promote greater use of this principle to remove heat from the hottest components of mobile devices. Japanese engineers were able to create a closed system a thickness of from 0.6 mm to 1 mm thin copper sheets with closed channels, in which coolant is converted into steam when heated, and then condensed by cooling, circulates under the action of natural forces. Flat heat pipe resembles a sandwich  the copper sheets having a thickness of 0.1 mm.  Two outer layers contain each other four internal. The evaporator is in contact with the smartphone processor , heat energy is transferred from it to the condensing plate which is partially dissipated. Fujitsu claims that such a system is five times effective in heat dissipation than conventional heat pipe.  We can only regret that the practical application of this development Fujitsu intends to begin no earlier than April 2017.  Such a structure can be placed not only in smartphone or tablet, but also in portable devices. Related Products :

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