As already reported , Sony intends to rapidly increase volume of output CMOS-image sensors. In parallel, the company end the release of Sensor type CCD, which at best characteristics are more expensive solution than the sensor type CMOS. This week, the company officially announced that in addition to plans to increase in February to August 2016 volume of output CMOS sensor from 60 thousand 300-mm wafers to 80,000 wafers volumes will be increased to 87,000 wafers per month by September 2016.
In February, the company announced the modernization of production cost 105 billion. Yen (about US $ 875 million). Additionally, the company will spend 45 billion. Yen ($ 375 million), 24 billion. Yen of which will receive a former factory Toshiba in Nagasaki (Nagasaki TEC), which is bought by Sony in 2011, and 21 billion. Yen will be sent to the former plant of Renesas in Yamagata (Yamagata TEC), bought by Sony two years ago. As you can see, Sony is well prepared for the expansion of the market for smartphones and tablets cameras.
Additional funds will be spent on the installation of equipment for the production of so-called stacked sensors with backlight (back-illuminated stacked CMOS image sensors) and for the release of the CCD. Stacked CMOS sensors are two-layered structure in which the image processor and the other brought to the second rail (bottom) layer of the sensor. This reduces the chip area without impairing its characteristics.