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Samsung shares plans about 14-nm process and 10 nm technology


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Samsung shares plans about 14-nm process and 10 nm technology


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POSTER: computer news   ||   SAMSUNG SHARES PLANS ABOUT 14-NM PROCESS AND 10 NM TECHNOLOGY

DATE:2016-04-26

Last week appeared information about Samsung's plans to improve the technical processes for the production of semiconductors.  Samsung  rarely shares  plans, so the weight of this information can not be overestimated.  Let's start with the fact that Samsung will offer customers 14-nm process technology with reduced production costs - 14LPC FinFET.  For the development of chips within 14LPC process technology will be used the same design tools, as for the 14-nm process technology second generation - 14LPP (Low-Power Plus).  The number of processing cycles for the production of chips 14LPC reduced, but not at the expense of  performance.  In other words, the cost of  chips will be smaller and  frequency potential will not be affected.

Mass production of chips within the technical process 14LPC starts this year.  By the end of the year in this technical process will be able to produce radio-frequency inductor-type components, thus paving the way for the integration of radio modules in the SoC crystals.  Samsung has put on the market more than 500 thousand Wafers with chips.  It is already well-functioning production with very low levels of defects - 0.2  per square.  cm.

In addition to the 10 nm process technology LPE (Low-Power Early) company immediately prepares the mate - nm process technology 10 LPP (Low-Power Plus).  Process technology 10LPP promises 10% better performance than the technical process 10LPE.  There are already rumors that the 10-nm process technology  Samsung second generation, which include 10LPP, will be embedded into mass production before the end of this year.  .  Developers this year will save time and will quickly get the products with the best performance.

The company also reported that the development is carried out 7-nm process technology 7LPE.  Samsung Company for the production of critical layers will almost certainly use the advanced EUV-scanners with a wavelength of 13.5 nm.  Such a scenario is also seen in TSMC company , while Intel is against the use of EUV-scanners configured negatively.   Samsung's argue the necessity of partly go to of EUV-projection in that for the production of 7-nm chips using 193-nm scanners take three mask (and three processing cycle) for each layer, as it will increase the number of photomasks  60 to 90 pieces, that unreasonably expensive.

Improving technical processes will be followed not only by reducing the projection scale  .  Samsung can continue to develop the 28-nm process technology.  In particular, the 28-nm process chip production on a fully depleted FD-SOI wafers will be added ability to integrate flash memory and radio frequency components.  The company will continue to offer customers the production of chips on 200-mm wafers on the process from 180 nm to 65 nm.  Such decisions will have all the modern extension of integrated flash memory, the RF-components, sensors and more.  According to the Samsung, it will help to "satisfy a chip famine in regions in need of advanced semiconductors."


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