Graphics Processor AMD Fiji

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POSTER: computer news   ||   GRAPHICS PROCESSOR AMD FIJI	DATE:2016-09-13
One of the participants 3DCenter.org conference armed with the necessary tools to spread out on layers GPU AMD Fiji.  As explained by the author, for the separation of the assembly parts from each other GPU had to warm up to 400 degrees Celsius. In the first photo  offer crystal itself GPU Fiji.. The second illustration shows that the GPU chip on the silicon bridge is not completely separated.  However, the bottom of the GPU chip looked like this: In the lower left corner   visible piece of silicon bridge is not separated from the GPU. Chips HBM memory type   is also subjected to the selective dismantling and grinding the top layer. On the penultimate shot HBM type of memory chip shows its colorful bottom layer of silicon with a large piece of the bridge.   One type of intermediate layers HBM memory chip also demonstrates abundance contacts on their surface.   Related Products :

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