In official press release, Samsung reported that its facilities started mass production of 14-nm single-chip new generation of schemes for wearable electronics. This SoC Exynos 7270 Dual 7 on two computing cores Cortex-A53. According to new energy efficiency 20% higher than their 28-nm predecessors.
Another unique feature of the SoC Exynos 7 Dual 7270 was the integration of the solution is almost complete set of wireless interfaces. First of all - this is a cellular modem LTE Cat.4 2CA. Also in the SoC are FM receiver and GNSS (satellite navigation), and Wi-Fi module and Bluetooth. Install all the required blocks into one chip housing with sides 10 x 10 mm was possible thanks to multichip packaging technologies such as SiP (system-in-package). Other packaging technology - ePoP (embedded package on package) - allowed to pack into the case with the processor and DRAM memory chips NAND-flash. This stack arrangement of crystals when the crystals are mounted on the memory chip SoC. The thickness of the chip decreased by 30% compared to conventional solutions. Related Products :
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