POSTER:computer news || IN LATE JUNE, A TOOL WILL APPEAR TO REMOVE THE COVERS FROM SKYLAKE-X AND KABY LAKE-X
DATE:2017-06-13
If the protective cover can be removed from the Kaby Lake processors using a blade, then it's rather difficult and risky to do with the Skylake-X processors. The Skylake-X substrate is a composite circuit board design and contains a number of discrete elements. In the process of removing the cover with a blade, surface-mounted components are easily damaged. To prevent this, an enthusiast named Der8auer developed a simple mechanism for shifting the cover by screwing.
For Skylake-X processors, the mechanism for removing the cover is represented by a prototype. The final version will appear at the end of June and then it will be available. It is claimed that removing the cover with the help of a new set of Deli Die Mate X is safe and tested on 10-20 Skylake-X processors. All of them are "scalped" without damaging SMD-elements and after the procedure work fine.
The removal of the covers from the Skylake-X and Kaby Lake-X processors is possible and justified by the fact that Intel uses thermal paste with insufficient thermal conductivity instead of the solder for removing heat from the crystal. After the replacement of the thermal paste, Skylake-X processors are ready to conquer the heights, which are inaccessible to the models in the factory version.
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IN LATE JUNE, A TOOL WILL APPEAR TO REMOVE THE COVERS FROM SKYLAKE-X AND KABY LAKE-X
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