LGA 1156 serious problems under overclock

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POSTER: computer news   ||   LGA 1156 SERIOUS PROBLEMS UNDER OVERCLOCK	DATE:2009-10-18
Appearance for new platforms on the market  is frequently accompanied by different problems. Associate probably, revealed one of the first serious problems of LGA 1156. In the process of extreme overclock their test processor core i 7-870 malfunctioned.   Investigation showed that the socket design was defective. The plugs were located at a different height and a part of them did not obtain to the contact areas of processor.   The socket from production AMP/LOTES proved to be higher in quality, the contact is distinctly visible on all contact areas: As it was already noted, a part of pins did not ensure reliable contact with the processor that in turn led to a reduction in the effective number of contacts, which correspond to the processor power. Under load the processor begins to consume high w, which in turn leads to the heating of conductors. The reduction of the effective number of conductors to a considerable degree increases the specific heat, which penetrates the utilized pins, and since contemporary processors consume tens amperes, the excessive heating of pins is not a surprise. Furthermore, the number of contact areas, for the power of processor, in LGA 1156  is almost one and half times less than in LGA 1366, and here current TDP is almost similar. However, under regular operating conditions problem will not appear, but here with overclock the probability of its occurrence considerably rises. Related Products :

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