|
VIA technologies company presented a new development in the region of small built in systems, whose release was announced during August. The discussion deals with open specification standard size mobile-ITX, intended for creating supercompact and mobile built in systems.
Specification determines the parameters of x86- compatible product, which relates to the category computer in module, whose printed-circuit board has sizes 6x6 , Mobile-ITX is the most compact standard size , it is up to 50% less than the standard size pico-ITX, also developed BY VIA.
The modular construction, which lies at the basis Of mobile-ITX, assumes the use of module processor paired with input-output card . This simplifies the devices design , since developers can install CPU module in the input-output card, adapted taking in account the device application field . On the card CPU module includes the microprocessor, chipset and memory.
For connection to the input-output processor module has on the lower surface two low-profile connector with the very close-packed arrangement . The distance between two printed-circuit boards composes altogether only 3 mm. The important special feature of the processor module mobile-ITX is the small energy consumption.
The reference model of processor module was simultaneously presented. In it is used the processor VIA C 7 M ULV, 2 GB DDR2 memory chipset VIA VX820 with integrated GPU VIA chrome9 HC3. Commercial accessible first processor modules mobile-ITX will appear in the first quarter next year. Related Products :
|