The technical process of microcircuit production implies processing silicic plates with some diameter. The greater this diameter, the higher the productivity of factory and the lower the prime cost, but a constant increase in the diameter of silicic plates turns around by enormous expenditures for the technological production rearmament . Now the largest diameter of workable in series silicic plates is equal to 300 mm, but within the next few years can begin the passage to the standard size 450 mm.
The European producers of lithographic equipment were combined with Intel within the organization EEMI-450, which places with its purpose preparation for the passage to the standard size 450 mm and attraction to the production of the European producers customers from a number of important semiconductor microcircuit producers. The group is formed of 28 companies participants invite to the collaboration and TSMC. Samsung and TSMC also try to accelerate passage to the use of silicic plates standard size 450 mm.
In the opinion of market participants , passage on 450 mm plate within the experimental production can take place not earlier than the 15 nm technological standards. Other experts consider that the passage on 450 mm plate generally can never not take place. Under these conditions, the producers will be forced squeeze out additional reserves of 300 mm plates. Passage from 200 mm to 300 mm plates in its time allowed to increase productivity by 2,6 times. Analysts doubt, that the passage on 450 mm plate will ensure the same effect, but without these colossal expenditures for the rearmament of production cannot be paid within the reasonable periods.