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Many overclocker already have a good idea about the effectiveness of memory modules cooling systems with the aid of thermal tubes, memory overclocker producers also unite efforts in the cooling systems of the corresponding products in the market. Some time ago , we wrote that OCZ technology company plans to equip its memory modules with cooling system that support the technology, conditionally designated as Flexpipe. From the usual heat-distributer heat go through the thermal tube, on which was threaded passive radiator.
Idea was not forgotten, and yesterday OCZ technology company announced the memory module series reaper HPC : as it was communicated in the press release, this is high performance memory modules with the complex passive cooling system .
Radiators are made from aluminum, the thickness and the edges step of the upper radiator is specially selected in order to ensure the optimum cooling conditions . Producer asserts that the additional radiator allow to increase the cooling surface area by two times.
The first result of series reaper HPC will became the dual-channel memory complete set of type PC 2-8500 (DDR 2-1066) volume 2 X 1 Gb, which has latency 5-5-5-15 and supporting EPP technology . Working voltage is equal to 2.1 v, it is possible to increase it to 2.4 v without voiding your warranty . Related Products :
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