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After removing the cover of engineering model Ivy Bridge, associate found that the heat spreader was not soldered to the processors Sandy Bridge, but some thermal-paste was used. Associate just made the assumption that the solder has a much higher thermal conductivity than the thermal interface of Ivy Bridge processors.
In fact, that thermal compound is a bottleneck in the chain of heat transfer. It does not allow to remove heat fast enough, causing the core temperature much higher compared to Sandy Bridge - equal to the difference of frequencies and voltages can reach 20 degrees Celsius. At the default frequency difference is much smaller, and in this regard Intel simply does not consider the interests of overclocker, giving preference to certain technological factors that have forced her to change the special solder to the grease.
The theory of increasing the density of thermal energy can not become a dominant explanation , because the difference in the core area of Ivy Bridge and Sandy Bridge does not exceed 25-30% . Further research on this topic should be clarified. Related Products :
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