According to the press service of Samsung company , the South Korean manufacturer began to produce silicon-density memory components LPDDR2 4Gb in accordance with 20 nm processor technology class (under this definition fit 20-29 nm lithographic technology).
The new products will enable Samsung to pack on a chip thickness of 0.8 mm 4 crystals LPDDR2 total memory capacity of 2 GB and the bandwidth of 1066 Mbit / s. Samsung expects that the solution presented by the crystals quickly replace the density of 2 Gbps, made on 30-nm process technology class.
According to analysts, the LPDDR2 standard in the coming years will be increasingly popular among manufacturers of mobile electronics. If in 2012 the product of this type make only 12% of total mobile chip DRAM, then in 2013 and 2014 it will to increase to 49% and 63%, respectively. Related Products :
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