During his speech at the autumn session of IDF in 2012 one of the leading Intel developers, Mark Bohr confirmed that the processors using 14-nm process will released at the end of next year. Two years later - in 2015 - will be a transition to 10 nm process technology, and then to 7 nm and 5 nm. What is important, the release of semiconductors using 14-nm and 10-nm process will be carried out with the use of modern production equipment for immersion lithography without transition to a fundamentally new tools. But significant changes need to be done to make the preparation of masks for projection, the elements density which have to be doubled to 14-nm semiconductor and four times for 10-nm.
In the answers to the questions from the audience of Intel confirmed that the company knows how to produce semiconductors in the form of 3D-chip level packaging. But produce 3D-processor Intel considers inappropriate. This approach is justified for the production of low-power solutions with consumption of about 1 W, whereas 30-40 w solutions fail to properly dissipate heat from packaged in super-dense column of crystals.
Intel is still hoping in EUV-lithography. Theoretically, the production of the first EUV-lithography equipment is expected in 2015, but the technology company admitted that, apart from these dates, it is expected a more active development of EUV-range of industries. However, the specific timing of the introduction of new scanners to produce semiconductors Mr. Bohr did not name. Related Products :
|