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We already published in previous news that the first 32 nm AMD processors will appear in 2009, and the first 45 nm processors will appear already in the middle of 2008. Since AMD decided to change technical process every two years , processors production update will be sufficiently intensive. Two stages are provided for the mastery of 45 nm technical process: On the first stage will be used the extended silicon technologies (strained silicon) and materials with ultra-low dielectric constant value (ultra-low- k dielectrics), at the second stage will be created the conditions for the mastery of materials with high dielectric value constant (high- k) and metallic locks .
The last technologies will start its application within the 32 nm technical process, which will be mastered on the reconstructed fab 38 in the middle of 2009. With IBM assistance , AMD company plans to inject within the 32 nm technical process also the technologies combination made with : ultra-low- k dielectrics and Vacuum air-Gap. Products Produced on the optimized 32 nm technical process will begin to dispatch in 2010.
Talking about the cooperation with contractors and its own factories , here there is no changes up to 2009, until the appearance of hybrid processors fusion. In 2009 , AMD processors will be released at the personal factories of this company and by chartered semiconductor. Chipset, video chips and chips for multimedia devices up to 2009 will be released only by TSMC and UMC companies . For assembly and products testing , AMD will use a third enterprises.
In 2009, after the release of bulldozer generation processors , AMD company will reexamine the diagram of its labor division . AMD representatives reported about a new achievement in the release level of suitable ( barcelona processors with four core ), which was equal to the release level of dual core processors . This is very good index from a economic side. Related Products :
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