AMD Next generation factory

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POSTER: computer news   ||   AMD NEXT GENERATION FACTORY	DATE:2007-10-25
In the end of this year AMD company hopes to start the reconstruction of Fab 30 , which will allow it to release silicic plates with 300 mm  diameter instead of the present 200 mm. Plate with the increased diameter allow to obtain more processors . Accordingly, the prime cost of processor production should be reduced,. Intel company  now release processors with 300 mm plates, and up to 2012 it expects to begin the migration for 450 mm plate. AMD do not plan to pass for the use of 450 mm silicic plates within the next few years. Instead of this AMD will optimize the production process with the use of previous 300 mm plates - concept was called Next generation factory (NGF). Company intends to increase the equipment load degree . The first tests of new concept already bring their fruits. For example, monthly expenditures for silicic plates was reduced by 26%, output volumes was increased by 31%. According to AMD representatives statements , this is only the small part of production optimization potential , which lies in the concept NGF. Related Products :

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