So far only NEC and Sony decided to use heat pipes in smartphones to redistribute the generated heat.
According to the site DigiTimes, manufacturers of heat pipes are ready to switch from laptops to smartphones, this product reduced diameter from 0.6 mm to 0.4 mm. It could go on conditional diameter - that is, the inner, which ignores the thickness of the walls of the tube. According to sources, the heat pipes are comparable in price with graphite modules to dissipate heat, but provide a much higher rate of transfer of heat energy.
In industry, there are four manufacturers ready to produce heat pipes with a diameter of 0.4 mm. These are the two Japanese companies (Furukawa Electric and Fujikura) and two Taiwanese (Chaun-Choung Technology and TaiSol Electronics). While the level of product yield in this size category is not high enough to count on the massive use of heat pipes in smartphones, but the producers expect that 2015 will be a watershed for the industry in this sense.