Assembling Samsung ePOP contains nine crystals
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POSTER: computer news || ASSEMBLING SAMSUNG EPOP CONTAINS NINE CRYSTALS |
DATE:2015-02-22 |
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To save space on smartphone, Samsung makes Apple's packaging of the processors Ax RAM LPDDRx. C recently, Samsung has offered packaged in a single case with processor flash memory controller. To do this, Samsung has developed packaging ePOP, which combines crystals MLC NAND-flash and crystals LPDDR3. This allows the transfer of the processor body and all necessary system memory: long and short term, saving thus space on the circuit board. Tthe new processor Apple will have similar ePOP-superstructure. By the way, Samsung reported that they are ready to be packed into a single case also LPDDR4 memory and flash modules with serial interface UFS.  As you can see, the proposed assembly comprises a controller Samsung flash memory interface eMMC, four 64-Gbit chip NAND MLC (32 GB) and four 6 Gbps crystal LPDDR3. Of course, all this is soldered to the upper connecting pad application processor SoC. There is, another aspect of benefits of such assemblies to the traditional multiple-soldering. If the memory is external, the processor should have much more contact. It is several hundred solder balls on a very limited area. If you move the memory of the processor, unsoldering SoC will be much easier. Alignment buildings SoC on the circuit board before soldering - is a major headache to Chinese manufacturers. Related Products : | ||
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ASSEMBLING SAMSUNG EPOP CONTAINS NINE CRYSTALS |
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