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The first data about the processors Havendale and Lynnfield, which will be based on Nehalem architecture in the desktop segment ( first half 2009), appeared yesterday .
Quad processors Lynnfield LGA 1160 will be limited to a TDP value not over 95 W, and an embedded controller PCI Express will enable to share the PCI Experss x16 power for two PCI Express x8. PCI Express will conform the version 2.0 specifications . This processor can work with discrete graphics cards and support CrossFire systems with two graphics cards.
Given that Ibexpeak chipsets will support eight PCI Express lines alone, the number of video cards in the system could be increased to four. But In this case user have to be satisfied with PCI Express x4.
Dual processors Havendale will receive a multi chip layout united in the same crystal, a graphical core, the memory controller and PCI Express controller will be placed in a different crystal. Both core design will be combined in one package installed in the LGA 1160 socket. TDP Level for Havendale processors will be lower than 95 W, the exact value is not reported. As default PCI Express controller will maintain one channel PCI Express x16 Generation 2.0.
This chart shows the device system based on Havendale processor with integrated graphical core. chip Ibexpeak support fourteen USB 2.0 ports (two with EHCI), six-port Serial ATA (one from FIS), eight channels PCI Express and four PCI slots, as well as Gigabit network interface. That decision may work with a wireless network adapter Wi-Fi or WiMAX.
The first Nehalem generation processor designs already exist. They are intended for use in server systems. Bloomfield processors and Gainestown LGA 1366 will appear in the fourth quarter 2008. The first samples of Lynnfield and Havendale processors LGA 1160 will appear in the third quarter 2008, mass production will be deployed in the first half 2009, and the announcement will be closer to mid-year 2009. 8 Core Nehalem generation processors will be presented in the server segment in the second half year 2009. They will be produced in 45 nm technology, the TDP will be limited to the value of 130 Watts.
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