Associate disassembled the smartphone Sony Xperia Z5. This device is based on the Snapdragon processor 810. With excess heat Sony engineers decided to fight with two heat pipes, which were also recovered among other internals of the smartphone.
A large number of individual components indicates the possibility of painless replacement in case of failure, the greatest difficulty is only when removing the rear cover: it is held by adhesive . Completely disassembling process Xperia Z5 is shown in the video prepared by the site Witrigs.