In recent years it has been done a lot of steps along the way to transition to the production of semiconductors on wafers of larger diameter. Several years ago, a group of companies and institutions of the consortium Global 450 Consortium was formed (G450C). As part of a consortium Intel , TSMC, GlobalFoundries, IBM, Samsung, and the American Institute of SUNY Polytechnic Institute representatives have tried to develop a transition program for processing wafers 450 mm in diameter. By comparison with a 300-mm plates with each 450-mm wafer will be obtained twice more chips. This was seen as insurance for the case when the manufacturers will rest in the limit of reducing the scope of technical processes and, in general, in the completion of the work of Moore's Law.
As shown in recent years, Moore's law somehow continues. Chip manufacturers continue to reduce production costs in terms of a single transistor, although not as impressive pace as before. But the main reason for the stop motion in the direction of the transition to 450-mm wafers, has been the reluctance of manufacturers to produce new machines and related tools. In any case, so experts believe.
The transition to the larger diameter plate would reduce the need for equipment for processing 300 mm wafers. equipment market would be greatly reduced, what tools manufacturers are not willing to go. On the other hand, chip manufacturers, too, are aware that the commissioning of the 450-mm line will be worth the cost, which in modern conditions "turbulent economy" may never be recouped. Therefore, as it became known Internet resource EE Times, at the end of last year, all members of the consortium G450C unanimously agreed transition program for processing 450-mm wafers later. It has not been forgotten. It's just postponed until better days - 5-10 years or for another term.
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