Intel will transport Broadwell-E processors in more reliable packaging

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POSTER: computer news   ||    INTEL WILL TRANSPORT BROADWELL-E PROCESSORS IN MORE RELIABLE PACKAGING	DATE:2017-07-02
More often we heard about the fact that Intel Corporation optimizes the packaging of finished products in terms of reducing the size and costs of materials.  However, in this area, it is necessary to observe a balance of interests, and if protection of the same processors from mechanical influences during transportation requires increased packaging, then Intel does not hesitate to take similar measures.  This week, the company issued a notice informing it of its intention to supply boxes with processors in the tray-version with reinforced foam inserts (pictured right). Such inserts will be equipped with boxes with processors of individual models, including the Broadwell-E family, server Xeon E5 and E7, and also some processors for embedded systems. What incidents forced Intel to take such a step is not specified.  Consumers will be able to receive boxes with processors, equipped with new inserts, after July 31 this year. Related Products :

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