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In this year we reported about havendale processors with the integrated graphic core from intel company with the multi-chip layout, which unites in one packing two crystals.
If penryn generation processors was satisfied by 6-8 base layer, then in nehalem generation processors their quantity was increased to 10-14 pieces. With passage of graphic core from chipset to the processor the packing type will be replaced from BGA to FC. The design of chipset series ibex peak will be also complicated, although some functions of the north bridge will be transmitted to processor. Related Products :
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