Intel company prepare a new CPU solution , which will become heart for ultra-portable mobile computers : thin notebook ( case thickness less than 25 mm ).

This processor will be built on the core architecture (modification of ULV- solutions (Ultra-Low-Voltage)), it is intended for inexpensive thin notebook (cheaper than $1500 : in the range $700-$900)
Thus, Intel is intended to fill the niche between devices, atom and more expensive notebook.
New Intel CPU with the packing 22 X 22 mm will be close in parameters to the models SU9300 and SU9400 (Core 2 Duo ULV mobile), probably, its TDP will be lower than 10 W.